是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | FBGA, BGA56,8X8,32 | Reach Compliance Code: | unknown |
风险等级: | 5.69 | 最长访问时间: | 90 ns |
JESD-30 代码: | S-PBGA-B56 | 内存集成电路类型: | MEMORY CIRCUIT |
混合内存类型: | FLASH+PSRAM | 端子数量: | 56 |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | FBGA |
封装等效代码: | BGA56,8X8,32 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, FINE PITCH | 电源: | 3 V |
认证状态: | Not Qualified | 子类别: | Other Memory ICs |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
S71GL032NA0BHW0K0 | CYPRESS |
获取价格 |
Memory IC | |
S71GL032NA0BHW0K2 | CYPRESS |
获取价格 |
Memory IC | |
S71GL032NA0BHW0K3 | CYPRESS |
获取价格 |
Memory IC | |
S71GL032NA0BHW0P2 | CYPRESS |
获取价格 |
Memory IC | |
S71GL032NA0BHW0P3 | CYPRESS |
获取价格 |
Memory IC | |
S71GL032NA0BHW0U0 | SPANSION |
获取价格 |
Memory Circuit, Flash+SRAM, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALO | |
S71GL032NA0BHW0U2 | SPANSION |
获取价格 |
Memory Circuit, Flash+SRAM, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALO | |
S71GL032NA0BHW0U3 | SPANSION |
获取价格 |
Memory Circuit, Flash+SRAM, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALO | |
S71GL032NA0BHW0Z0 | SPANSION |
获取价格 |
Memory Circuit, Flash+SRAM, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALO | |
S71GL032NA0BHW0Z2 | SPANSION |
获取价格 |
Memory Circuit, Flash+SRAM, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALO |