S3A-C THRU S3M-C
3.0A Surface Mount General Purpose
R
ectifiers - 50V-1000V
Features
P
g
acka e outline
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
SMC/DO-214AB
For surface mounted applications
Low reverse leakage
Built-in strain relief,ideal for automated placement
High forward surge current capability
0.245(6.22)
0.220(5.59)
0.126 (3.20)
0.114 (2.90)
High temperature soldering guaranteed:
250 C/10 seconds at terminals
Glass passivated chip junction
Compliant to RoHS Directive 2011/65/EU
Compliant to Halogen-free
0.280(7.11)
0.260(6.60)
0.012(0.305)
0.006(0.152)
0.103(2.62)
0.079(2.06)
Mechanical data
Case: JEDEC DO-214AB molded plastic body
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
0.060(1.52)
0.030(0.76)
0.008(0.203)MAX.
0.320(8.13)
0.305(7.75)
Polarity: Color band denotes cathode end
Mounting Position: Any
Dimensions in inches and (millimeters)
Maximum ratings and Electrical Characteristics (AT TA=25oC unless otherwise noted)
Symbol
TYP.
UNIT
A
MIN.
MAX.
PARAMETER
CONDITIONS
IO
Forward rectified current
See Fig.1
3.0
IFSM
100
Forward surge current
A
8.3ms single half sine-wave (JEDEC methode)
VR = VRRM TA = 25OC
VR = VRRM TA = 100OC
5.0
IR
Reverse current
μA
50
Junction to ambient
NOTE 1
OC/W
Thermal resistance
RθJA
50
60
CJ
pF
OC
Diode junction capacitance
Storage temperature
f=1MHz and applied 4V DC reverse voltage
+150
-65
TSTG
Note:
1.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas
Operating
temperature
TJ, (OC)
*1
*3
*4
*2
VRMS
VR
VF
SYMBOLS
VRRM
(V)
(V)
(V)
(V)
*1 Repetitive peak reverse voltage
*2 RMS voltage
35
S3A-C
S3B-C
S3D-C
S3G-C
50
50
100
200
400
70
100
200
400
*3 Continuous reverse voltage
140
280
1.10
-55 to +150
*4 Maximum forward voltage@IF=3.0A
600
800
420
560
700
600
800
S3J-C
S3K-C
S3M-C
1000
1000
http://www.anbonsemi.com
TEL:+86-755-23776891
FAX:+86-755-81482182
Document ID
AS-3010012
Issued Date
2003/03/08
Revised Date
Revision
Page.
2023/09/07
F
3
Page 1