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S29GL128P90TFIR10 PDF预览

S29GL128P90TFIR10

更新时间: 2024-02-09 04:54:24
品牌 Logo 应用领域
赛普拉斯 - CYPRESS PC光电二极管内存集成电路闪存
页数 文件大小 规格书
82页 901K
描述
Flash, 128MX1, 90ns, PDSO56, TSOP-56

S29GL128P90TFIR10 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TSOP1
包装说明:HTSSOP, TSSOP56,.8,20针数:56
Reach Compliance Code:unknownECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:3.93
Is Samacsys:N最长访问时间:90 ns
备用内存宽度:8命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PDSO-G56JESD-609代码:e3
长度:18.4 mm内存密度:134217728 bit
内存集成电路类型:FLASH内存宽度:1
湿度敏感等级:3功能数量:1
部门数/规模:128端子数量:56
字数:134217728 words字数代码:128000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:128MX1
封装主体材料:PLASTIC/EPOXY封装代码:HTSSOP
封装等效代码:TSSOP56,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH页面大小:8/16 words
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:3.3 V编程电压:3 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:1.2 mm部门规模:128K
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.11 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
切换位:YES类型:NOR TYPE
宽度:14 mmBase Number Matches:1

S29GL128P90TFIR10 数据手册

 浏览型号S29GL128P90TFIR10的Datasheet PDF文件第1页浏览型号S29GL128P90TFIR10的Datasheet PDF文件第2页浏览型号S29GL128P90TFIR10的Datasheet PDF文件第4页浏览型号S29GL128P90TFIR10的Datasheet PDF文件第5页浏览型号S29GL128P90TFIR10的Datasheet PDF文件第6页浏览型号S29GL128P90TFIR10的Datasheet PDF文件第7页 
S29GL01GP  
S29GL512P  
S29GL256P  
S29GL128P  
Contents  
1.  
2.  
3.  
4.  
Ordering Information................................................... 4  
11.7 AC Characteristics........................................................ 53  
Input/Output Descriptions & Logic Symbol .............. 6  
Block Diagram.............................................................. 7  
Physical Dimensions/Connection Diagrams............. 8  
12. Appendix ..................................................................... 64  
12.1 Command Definitions.................................................... 64  
12.2 Common Flash Memory Interface................................. 73  
13. Advance Information on S29GL-S Eclipse 65 nm  
MirrorBit Power-On and Warm Reset Timing........... 77  
14. Document History....................................................... 79  
4.1 Related Documents ....................................................... 8  
4.2 Special Handling Instructions for BGA Package............ 8  
4.3 LAA064—64 ball Fortified Ball Grid Array, 11 x 13 mm. 9  
4.4 TS056—56-Pin Standard Thin Small Outline Package  
(TSOP)......................................................................... 11  
5.  
Additional Resources................................................ 12  
5.1 Application Notes......................................................... 12  
5.2 Specification Bulletins.................................................. 12  
5.3 Hardware and Software Support.................................. 12  
5.4 Contacting Cypress...................................................... 12  
6.  
6.1 Memory Map................................................................ 13  
7. Device Operations ..................................................... 15  
Product Overview ...................................................... 13  
7.1 Device Operation Table ............................................... 15  
7.2 Word/Byte Configuration.............................................. 16  
7.3 Versatile IOTM (VIO) Control......................................... 16  
7.4 Read ............................................................................ 16  
7.5 Page Read Mode......................................................... 16  
7.6 Autoselect .................................................................... 17  
7.7 Program/Erase Operations .......................................... 21  
7.8 Write Operation Status................................................. 32  
7.9 Writing Commands/Command Sequences.................. 36  
8.  
Advanced Sector Protection/Unprotection ............. 38  
8.1 Lock Register............................................................... 39  
8.2 Persistent Protection Bits............................................. 39  
8.3 Persistent Protection Bit Lock Bit................................. 41  
8.4 Password Protection Method....................................... 41  
8.5 Advanced Sector Protection Software Examples ........ 44  
8.6 Hardware Data Protection Methods............................. 44  
9.  
Power Conservation Modes...................................... 45  
9.1 Standby Mode.............................................................. 45  
9.2 Automatic Sleep Mode................................................. 45  
9.3 Hardware RESET# Input Operation............................. 45  
9.4 Output Disable (OE#)................................................... 45  
10. Secured Silicon Sector Flash Memory Region ....... 46  
10.1 Factory Locked Secured Silicon Sector....................... 46  
10.2 Customer Lockable Secured Silicon Sector................. 47  
10.3 Secured Silicon Sector Entry/Exit Command  
Sequences................................................................... 47  
11. Electrical Specifications............................................ 49  
11.1 Absolute Maximum Ratings ......................................... 49  
11.2 Operating Ranges........................................................ 50  
11.3 Test Conditions............................................................ 50  
11.4 Key to Switching Waveforms ....................................... 51  
11.5 Switching Waveforms .................................................. 51  
11.6 DC Characteristics....................................................... 52  
Document Number: 002-00886 Rev. *B  
Page 3 of 83  

S29GL128P90TFIR10 替代型号

型号 品牌 替代类型 描述 数据表
S29GL128P90TFIR20 CYPRESS

完全替代

Flash, 128MX1, 90ns, PDSO56, TSOP-56
S29GL128P90TAIR10 CYPRESS

完全替代

Flash, 128MX1, 90ns, PDSO56, TSOP-56

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