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S29CD032J0JFFI100 PDF预览

S29CD032J0JFFI100

更新时间: 2024-01-27 09:52:09
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路
页数 文件大小 规格书
76页 1861K
描述
32/16 Megabit CMOS 2.6 Volt or 3.3 Volt-only Simultaneous Read/Write, Dual Boot, Burst Mode Flash Memory with VersatileI/O

S29CD032J0JFFI100 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:BGA
包装说明:LBGA,针数:80
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.03
最长访问时间:54 ns其他特性:SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK
启动块:TOPJESD-30 代码:R-PBGA-B80
JESD-609代码:e1长度:13 mm
内存密度:33554432 bit内存集成电路类型:FLASH
内存宽度:32湿度敏感等级:3
功能数量:1端子数量:80
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:1MX32
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):260
编程电压:2.7 V认证状态:Not Qualified
座面最大高度:1.4 mm最大供电电压 (Vsup):2.75 V
最小供电电压 (Vsup):2.5 V标称供电电压 (Vsup):2.6 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
类型:NOR TYPE宽度:11 mm
Base Number Matches:1

S29CD032J0JFFI100 数据手册

 浏览型号S29CD032J0JFFI100的Datasheet PDF文件第4页浏览型号S29CD032J0JFFI100的Datasheet PDF文件第5页浏览型号S29CD032J0JFFI100的Datasheet PDF文件第6页浏览型号S29CD032J0JFFI100的Datasheet PDF文件第8页浏览型号S29CD032J0JFFI100的Datasheet PDF文件第9页浏览型号S29CD032J0JFFI100的Datasheet PDF文件第10页 
D a t a S h e e t ( P r e l i m i n a r y )  
1. Ordering Information  
The order number (Valid Combination) is formed by the following:  
S29CD032J  
0
J
F
A
I
0
0
0
Packing Type  
0
=
Tray, FBGA: 180 per tray, min. 10 trays per box  
Tray, PQFP: 66 per tray, min. 10 trays per box  
2
3
=
=
7” Tape and Reel, FBGA: 400 per reel  
13” Tape and Reel, FBGA: 1600 per reel  
13” Tape and Reel, PQFP: 500 per reel  
Boot Sector Option (16th Character)  
0
1
3
4
=
=
=
=
Top Boot with Simultaneous Operation  
Bottom Boot with Simultaneous Operation  
Top Boot without Simultaneous Operation  
Bottom Boot without Simultaneous Operation  
Autoselect ID Option (15th Character)  
0
1
0
=
=
=
7E, 08, 01/00 Autoselect ID  
7E, 36, 01/00 Autoselect ID  
7E, 46, 01/00 Autoselect ID  
S29CD016J only  
S29CL016J only  
S29CD032J only  
S29CL032J only  
0
0
=
=
7E, 09, 01/00 Autoselect ID  
7E, 49, 01/00 Autoselect ID  
Temperature Range  
I
M
=
=
Industrial (–40°C to +85°C)  
Extended (–40°C to +125°C)  
Material Set  
A
F
=
=
Standard  
Pb-free Option  
Package Type  
Q
F
=
=
Plastic Quad Flat Package (PQFP)  
Fortified Ball Grid Array, 1.0 mm pitch package  
Clock Frequency (10th Character)  
J
=
=
=
=
40 MHz  
56 MHz  
66 MHz  
75 MHz (contact factory)  
M
P
R
Initial Burst Access Delay (9th Character)  
0
1
=
=
5-1-1-1, 6-1-1-1, and above  
4-1-1-1  
Device Number/Description  
S29CD032J/S29CD016J (2.5 volt-only), S29CL032J/S29CL016J (3.3 volt-only)  
32 or 16 Megabit (1 M or 512 K x 32-Bit) CMOS Burst Mode, Dual Boot, Simultaneous Read/Write Flash Memory  
Manufactured on 110 nm floating gate technology  
1.1  
Valid Combinations  
Valid Combinations lists configurations planned to be supported in volume for this device. Consult your local  
sales office to confirm availability of specific valid combinations and to check on newly released  
combinations.  
S29CD-J/S29CL-J Valid Combinations  
0J, 0M, 0P, 1J  
00, 01, 02, 03, 10, 11, 12, 13  
02, 03, 12, 13  
S29CD016J  
S29CL016J  
QAI, QFI, QAM, QFM  
FAI, FFI, FAM, FFM  
1M  
0J, 0M, 0P, 0R, 1J  
1M  
00, 01, 02, 03, 10, 11, 12, 13  
02, 03, 12, 13  
S29CD032J  
S29CL032J  
QAI, QFI, QAN, QFN  
FAI, FFI, FAN, FFN  
Note on BGA Package Markings  
The ordering part number that appears on BGA packages omits the leading “S29”.  
September 27, 2006 S29CD-J_CL-J_00_B1  
S29CD-J & S29CL-J Flash Family  
5

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