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S29AL016M90TFIR12 PDF预览

S29AL016M90TFIR12

更新时间: 2024-11-05 23:02:59
品牌 Logo 应用领域
飞索 - SPANSION 闪存
页数 文件大小 规格书
59页 2056K
描述
16 MEGABIT (2M X 8 BIT / I M X 16 BIT) 3.0 VOLT ONLY BOOT SECTOR FLASH MEMORY

S29AL016M90TFIR12 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSOP1包装说明:LEAD FREE, MO-142DD, TSOP-48
针数:48Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.83最长访问时间:90 ns
其他特性:TOP BOOT BLOCK备用内存宽度:8
启动块:TOP命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PDSO-G48JESD-609代码:e3
长度:18.4 mm内存密度:16777216 bit
内存集成电路类型:FLASH内存宽度:16
湿度敏感等级:3功能数量:1
部门数/规模:1,2,1,31端子数量:48
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:1MX16
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP48,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3.3 V
编程电压:3 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:16K,8K,32K,64K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.06 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40切换位:YES
类型:NOR TYPE宽度:12 mm

S29AL016M90TFIR12 数据手册

 浏览型号S29AL016M90TFIR12的Datasheet PDF文件第2页浏览型号S29AL016M90TFIR12的Datasheet PDF文件第3页浏览型号S29AL016M90TFIR12的Datasheet PDF文件第4页浏览型号S29AL016M90TFIR12的Datasheet PDF文件第5页浏览型号S29AL016M90TFIR12的Datasheet PDF文件第6页浏览型号S29AL016M90TFIR12的Datasheet PDF文件第7页 
S29AL016M  
16 Megabit (2 M x 8-Bit/1 M x 16-Bit)  
3.0 Volt-only Boot Sector Flash Memory  
featuring MirrorBitTM technology  
DATASHEET  
Data Sheet  
Distinctive Characteristics  
Architectural Advantages  
— 400 nA standby mode current  
— 15 mA read current  
„
„
„
Single power supply operation  
— 3 V for read, erase, and program operations  
— 40 mA program/erase current  
— 400 nA Automatic Sleep mode current  
Manufactured on 0.23 µm MirrorBitTM process  
technology  
SecSiTM (Secured Silicon) Sector region  
— 128-word/256-byte sector for permanent, secure  
identification through an 8-word/16-byte random  
Electronic Serial Number, accessible through a  
command sequence  
„
Package options  
— 48-ball Fine-pitch BGA  
— 64-ball Fortified BGA  
— 48-pin TSOP  
Software Features  
— May be programmed and locked at the factory or by  
the customer  
— Program Suspend & Resume: read other sectors  
before programming operation is completed  
— Erase Suspend & Resume: read/program other  
sectors before an erase operation is completed  
— Data# polling & toggle bits provide status  
— Unlock Bypass Program command reduces overall  
multiple-word programming time  
— CFI (Common Flash Interface) compliant: allows host  
system to identify and accommodate multiple flash  
devices  
„
„
Flexible sector architecture  
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and thirty-  
one 64 Kbyte sectors (byte mode)  
— One 8 Kword, two 4 Kword, one 16 Kword, and thirty-  
one 32 Kword sectors (word mode)  
Compatibility with JEDEC standards  
— Provides pinout and software compatibility for single-  
power supply flash, and superior inadvertent write  
protection  
Hardware Features  
„
„
„
Top or bottom boot block configurations available  
100,000 erase cycle typical per sector  
20-year typical data retention  
— Sector Protection: hardware-level method of  
preventing write operations within a sector  
Temporary Sector Unprotect: VID-level method of  
changing code in locked sectors  
Performance Characteristics  
— Hardware reset input (RESET#) resets device  
— Ready/Busy# output (RY/BY#) indicates program or  
erase cycle completion  
„
High performance  
— 90 ns access time  
— 0.7 s typical sector erase time  
„
Low power consumption (typical values at 5 MHz)  
Publication Number S29AL016M_00 Revision A Amendment 4 Issue Date April 21, 2004  

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