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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| RY3GB021 | SHARP |
获取价格 |
RF and Baseband Circuit, |
|
| RY3GB040 | SHARP |
获取价格 |
RF and Baseband Circuit, 42 X 33 MM, 8 MM HEIGHT, COMPACT PACKAGE-14 |
|
| RY3GB045 | SHARP |
获取价格 |
RF and Baseband Circuit, 42 X 33 MM, 8 MM HEIGHT, COMPACT PACKAGE-14 |
|
| RY3GB100 | SHARP |
获取价格 |
RF and Baseband Circuit, 42 X 33 MM, 8 MM HEIGHT, COMPACT PACKAGE-14 |
|
| RY3GH040 | SHARP |
获取价格 |
RF and Baseband Circuit, 42 X 33 MM, 8 MM HEIGHT, COMPACT PACKAGE-14 |
|
| RY3GH045 | SHARP |
获取价格 |
RF and Baseband Circuit, 42 X 33 MM, 8 MM HEIGHT, COMPACT PACKAGE-14 |
|
| RY3GH100 | SHARP |
获取价格 |
RF and Baseband Circuit, 42 X 33 MM, 8 MM HEIGHT, COMPACT PACKAGE-14 |
|
| RY-3WFZ-K | LITEON |
获取价格 |
MINIATURE RELAY 2 POLESâ1 to 2 A (FOR SIGNA |
|
| RY-3WZ-K | LITEON |
获取价格 |
MINIATURE RELAY 2 POLESâ1 to 2 A (FOR SIGNA |
|
| RY-3WZ-K | FUJITSU |
获取价格 |
Power/Signal Relay, DPDT, Momentary, 0.167A (Coil), 3VDC (Coil), 500mW (Coil), 1A (Contact |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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