RTQ2527A-QA
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
>
PGOOD Leakage Current V
V
= 5.25V, V
V
IT
--
0.1
1
A
PGOOD_LK
PGOOD
OUT
Shutdown, temperature
increasing
--
--
165
140
--
--
Thermal Shutdown
Temperature
T
C
SD
Reset, temperature decreasing
Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. Devices are ESD sensitive. Handling precautions are recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. For more information about thermal parameter, see the Application and Definition of Thermal Resistances report, AN061.
Note 5. θJA(EVB), ΨJC(TOP) and ΨJB are measured on a high effective-thermal-conductivity four-layer test board which is in size
of 70mm x 50mm; furthermore, all layers with 1 oz. Cu. Thermal resistance/parameter values may vary depending on
the PCB material, layout, and test environmental conditions.
Note 6. Guaranteed by design.
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RTQ2527A-QA_DS-00 January 2024
8