Datasheet > RS8554

RS8554

更新时间： 2024-04-09 19:00:01

品牌	Logo	应用领域
润石 - RUNIC		/
页数	文件大小	规格书
24页	867K
描述
The RS8551,RS8552,RS8554,RS8553(dual version &shutdown)series of CMOS operational amplifiers use auto-zero techniques to simultaneously provide very low offset voltage (5μV max) and near-zero drift over time and temperature. This family of amplifiers has

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RS8554 数据手册

RS8551,RS8552,RS8554

7 SPECIFICATIONS

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted) ⁽¹⁾

MIN

MAX

UNIT

Supply, V_S=(V+) - (V-)

Voltage

Current

Signal input pin ⁽²⁾

Signal output pin ⁽³⁾

Signal input pin ⁽²⁾

Signal output pin ⁽³⁾

Output short-circuit ⁽⁴⁾

(V-)-0.5

-10

(V+) +0.5

-55

Continuous

SOT23-5

230

110

170

105

SOIC-8(SOP8)

MSOP-8

θ_JA

Package thermal impedance ⁽⁵⁾

°C/W

SOIC-14(SOP14)

TSSOP-14

DFN2×2-8L

Operating range, T_A

-40

-65

125

150

(6)

Temperature Junction, T_J

Storage, T_stg

°C

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails

should be current-limited to 10mA or less.

(3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails

should be current-limited to ±55mA or less.

(4) Short-circuit to ground, one amplifier per package.

(5) The package thermal impedance is calculated in accordance with JESD-51.

(6) The maximum power dissipation is a function of T_J(MAX), R_θJA, and T_A. The maximum allowable power dissipation at any ambient

temperature is P_D= (T _J(MAX)- T_A) / R_θJA. All numbers apply for packages soldered directly onto a PCB.

7.2 ESD Ratings

The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

VALUE

±5000

±400

UNIT

Human-body model (HBM)

Machine Model (MM)

V_(ESD)Electrostatic discharge

ESD SENSITIVITY CAUTION

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

2.7

NOM

MAX

5.5

UNIT

Single-supply

Dual-supply

Supply voltage, V_S= (V+) – (V-)

±1.35

±2.75

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