CURRENT 3.0 Amperes
VOLTAGE 50 to 800 Volts
RS3A THRU RS3K
Features
· For surface mounted applications in order optimize
board space
· Low profile package
DO-214AB (SMC)
· Built-in strain relief, ideal for automated placement
· Fast switching speed
· Plastic package has Unerwrites Laboratory
Flammability Classification 94V-0
· Low forward voltage drop
0.124(3.15)
0.108(2.75)
0.245(6.22)
0.220(5.59)
0.280(7.11)
0.260(6.60)
· Glass passivated junction
· High temperature soldering guaranteed : 250℃/10
seconds, at terminals
0.012(0.31)
0.006(0.15)
0.103(2.62)
0.079(2.00)
Mechanical Data
· Case : JEDEC SMC(DO-214AB) molded plastic body
· Terminals : Plated axial lead solderable per
MIL-STD-750, method 2026
· Polarity : Color band denotes cathode end
· Weight : 0.007ounce, 0.25 gram
0.008(0.203)
MAX.
0.050(1.27)
0.030(0.76)
0.320(8.13)
0.305(7.75)
Dimensions in inches and (millimeters)
Maximum Ratings And Electrical Characteristics
(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
load. For capacitive load, derate by 20%)
Symbols
RS3A
RS3B
RS3D
RS3G
RS3J
RS3K
Units
Maximum recurrent peak reverse voltage
Maximum RMS voltage
V
RRM
RMS
50
35
50
100
70
200
140
200
400
280
400
600
420
600
800
560
800
Volts
Volts
Volts
V
Maximum DC blocking voltage
V
DC
100
Maximum average forward rectified current
at TL=75℃
I
(AV)
3.0
Amps
Amps
Volts
Peak forward surge current 8.3ms half sing
wave superimposed on rated load
(JEDEC method) TL=75℃
IFSM
100.0
1.30
Maximum instantaneous forward voltage
at 1.5A
V
F
T
T
A
=25℃
10.0
250
Maximum reverse
current at rated voltage
IR
μA
A=125℃
Maximum reverse recovery time (Note 1)
Typical thermal resistance (Note 3)
Typical junction capacitance (Note 2)
Trr
150
250
500
ns
RθJL
RθJA
15.0
50.0
℃/W
C
J
60.0
pF
T
J
Operating unction and storage
temperature range
℃
-55 to +150
TSTG
Notes:
(1) Test conditions: I
F=0.5A, IR=1.0A, Irr=0.25A.
(2) Measured at 1MHz and applied reverse voltage of 4.0 Volts.
(3) Thermal resistance from junction to ambient and from junction to lead mounted on
PCB mounted on 0.3×0.3"(8.0×8.0mm) copper opad areas.