RMB8M PDF预览

RMB8M

更新时间: 2025-07-15 08:57:59
品牌 Logo 应用领域
固锝 - GOOD-ARK /
页数 文件大小 规格书
3页 498K
描述
Bridge Rectifier Diode,

RMB8M 数据手册

 浏览型号RMB8M的Datasheet PDF文件第2页浏览型号RMB8M的Datasheet PDF文件第3页 
RMB2M - RMB10M  
Glass Passivated Fast Recovery Bridge Rectifier  
Reverse Voltage 200 to 1000 Volts Forward Current 0.5 Ampere  
Features  
Plastic package has Underwriters Laboratory Flammability  
Classification 94V-0  
Glass passivated chip junctions  
Fast recovery, low switching loss  
High temperature soldering guaranteed:260°C/10 seconds  
Long pointed leads: 3.70mm-4.05mm  
Mechanical Data  
Case:Molded plastic body over passivated junctions  
Terminals: plated leads solderable per MIL-STD-750,  
Method 2026  
Package: MBM  
Polarity:Polarity symbols marked on body  
Mounting Position: Any  
Weight:0.078 oz., 0.22g  
Maximum Ratings & Electrical Characteristics  
(TA=25°C unless otherwise noted)  
Parameter  
Symbol  
VRRM  
VRMS  
RMB2M  
200  
RMB4M  
400  
RMB6M  
600  
RMB8M RMB10M  
Unit  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
800  
560  
800  
1000  
700  
V
V
V
140  
280  
420  
Maximum DC blocking voltage  
Maximum Average forward output current  
VDC  
200  
400  
600  
1000  
0.5(1)  
0.8(2)  
IF(AV)  
A
(see Fig.1)  
on glass-epoxy P.C.B  
on aluminum substrate  
Peak forward surge current 8.3 MS single HALF sine-wave  
superimposed on rated load (JEDEC Method)  
IFSM  
30  
A
A2sec  
V
Rating for fusig (t<8.3ms)  
I2t  
5
Maximum instantaneous forward voltage drop  
per leg at 0.4A  
VF  
1.30  
Maximum DC reverse current at  
rated DC blocking voltage per leg  
TA=25°C  
5
IR  
µA  
nS  
TA=125°C  
100  
250  
150  
500  
Trr  
Maximum reverse recovery time at IF=0.5A,IR=1.0A,Irr=0.25A  
RθJA  
RθJA  
RθJL  
Cj  
85(1)  
70(2)  
20(1)  
Typical thermal resistance per leg  
°C/W  
pF  
°C  
Typical junction capacitance per at 4.0V,1.0MHz  
Operating junction and storage temperature range  
13  
-55 to +150  
T
J,TSTG  
Notes: 1. On glass epoxy P.C.B. mounted on 0.05×0.05"(1.3×1.3mm) pads  
2. On aluminum substrate P.C.B.whth an area of 0.8×0.8"20×20mmmounted on 0.05×0.05"(1.3×1.3mm) solder pad  
1/3  

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