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REF3140AIDBZRG4 PDF预览

REF3140AIDBZRG4

更新时间: 2024-11-24 11:06:35
品牌 Logo 应用领域
德州仪器 - TI 光电二极管
页数 文件大小 规格书
4页 82K
描述
4V、20ppm/°C(最大值)、100µA、3 引脚 SOT-23 串联电压基准 | DBZ | 3 | -40 to 125

REF3140AIDBZRG4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOT-23
包装说明:TSSOP, TO-236针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:6 weeks
风险等级:5.48模拟集成电路 - 其他类型:THREE TERMINAL VOLTAGE REFERENCE
JESD-30 代码:R-PDSO-G3JESD-609代码:e4
长度:2.92 mm湿度敏感等级:1
功能数量:1输出次数:1
端子数量:3最高工作温度:125 °C
最低工作温度:-40 °C最大输出电流:0.01 A
最大输出电压:4.1042 V最小输出电压:4.0878 V
标称输出电压:4.096 V封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TO-236
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.22 mm子类别:Voltage References
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.146 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS最大电压温度系数:20 ppm/ °C
温度等级:AUTOMOTIVE端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.96 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
微调/可调输出:NO最大电压容差:0.2%
宽度:1.3 mmBase Number Matches:1

REF3140AIDBZRG4 数据手册

 浏览型号REF3140AIDBZRG4的Datasheet PDF文件第2页浏览型号REF3140AIDBZRG4的Datasheet PDF文件第3页浏览型号REF3140AIDBZRG4的Datasheet PDF文件第4页 
REF3140-DIE  
www.ti.com  
SBVS205 JUNE 2012  
SERIES VOLTAGE REFERENCE  
Check for Samples: REF3140-DIE  
1
FEATURES  
Low Dropout  
High Output Current  
High Accuracy  
Low IQ  
APPLICATIONS  
Portable, Battery Powered Equipment  
Data Acquisition Systems  
Medical Equipment  
Hand Held Test Equipment  
DESCRIPTION  
The REF3140 is a precision, low power, low dropout, series voltage reference.  
The REF3140’s small size and low power consumption make it ideal for portable and battery-powered  
applications. The REF3140 does not require a load capacitor, but is stable with any capacitive load and can  
sink/source up to 10mA of output current.  
Unloaded, the REF3140 can be operated on supplies down to 5 mV above the output voltage.  
ORDERING INFORMATION(1)  
PACKAGE  
DESIGNATOR  
PRODUCT  
PACKAGE  
ORDERABLE PART NUMBER  
PACKAGE QUANTITY  
REF3140TDD1  
REF3140TDD2  
252  
10  
REF3140  
TD  
Bare die in waffle pack(2)  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality  
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room  
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not  
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2012, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

REF3140AIDBZRG4 替代型号

型号 品牌 替代类型 描述 数据表
REF3140AIDBZT TI

完全替代

4V、20ppm/°C(最大值)、100µA、3 引脚 SOT-23 串联电压基准 | D

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