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REF3140TDD1 PDF预览

REF3140TDD1

更新时间: 2024-11-26 11:45:55
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
4页 82K
描述
SERIES VOLTAGE REFERENCE

REF3140TDD1 技术参数

生命周期:Active包装说明:DIE,
Reach Compliance Code:not_compliantFactory Lead Time:8 weeks
风险等级:5.78模拟集成电路 - 其他类型:THREE TERMINAL VOLTAGE REFERENCE
JESD-30 代码:R-XUUC-N8功能数量:1
输出次数:1端子数量:8
封装主体材料:UNSPECIFIED封装代码:DIE
封装形状:RECTANGULAR封装形式:UNCASED CHIP
峰值回流温度(摄氏度):NOT SPECIFIED表面贴装:YES
温度等级:COMMERCIAL端子形式:NO LEAD
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
微调/可调输出:NOBase Number Matches:1

REF3140TDD1 数据手册

 浏览型号REF3140TDD1的Datasheet PDF文件第2页浏览型号REF3140TDD1的Datasheet PDF文件第3页浏览型号REF3140TDD1的Datasheet PDF文件第4页 
REF3140-DIE  
www.ti.com  
SBVS205 JUNE 2012  
SERIES VOLTAGE REFERENCE  
Check for Samples: REF3140-DIE  
1
FEATURES  
Low Dropout  
High Output Current  
High Accuracy  
Low IQ  
APPLICATIONS  
Portable, Battery Powered Equipment  
Data Acquisition Systems  
Medical Equipment  
Hand Held Test Equipment  
DESCRIPTION  
The REF3140 is a precision, low power, low dropout, series voltage reference.  
The REF3140’s small size and low power consumption make it ideal for portable and battery-powered  
applications. The REF3140 does not require a load capacitor, but is stable with any capacitive load and can  
sink/source up to 10mA of output current.  
Unloaded, the REF3140 can be operated on supplies down to 5 mV above the output voltage.  
ORDERING INFORMATION(1)  
PACKAGE  
DESIGNATOR  
PRODUCT  
PACKAGE  
ORDERABLE PART NUMBER  
PACKAGE QUANTITY  
REF3140TDD1  
REF3140TDD2  
252  
10  
REF3140  
TD  
Bare die in waffle pack(2)  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality  
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room  
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not  
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2012, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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