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RClamp0516P.TCT PDF预览

RClamp0516P.TCT

更新时间: 2024-11-17 01:16:39
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商升特 - SEMTECH /
页数 文件大小 规格书
8页 1341K
描述
Low Capacitance RClamp® 6-Line ESD protection

RClamp0516P.TCT 数据手册

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RClamp0516P  
Low Capacitance RClamp®  
6-Line ESD protection  
PROTECTION PRODUCTS - RailClamp®  
Features  
Description  
RClamp®0516P provides ESD protection for high-speed  
data interfaces. It features a maximum ESD withstand  
voltage of ±15kV contact and ±15kV air discharge per  
IEC 61000-4-2. RClamp0516P is designed to minimize  
both the ESD peak clamping and the TLP clamping.  
Package inductance is reduced at each pin resulting in  
lower peak ESD clamping voltage. The dynamic resis-  
tance is extremely low at 0.20 Ohms (typical). Maxi-  
mum capacitance on each line to ground is 0.65pF  
allowing the RClamp0516P to be used in applications  
operating in excess of 5GHz without appreciable signal  
attenuation. Each device will protect up to six lines  
(three high-speed pairs).  
‹ ESD protection for high-speed data lines to  
IEC 61000-4-2 (ESD) ±15kV (air), ±15kV (contact)  
IEC 61000-4-5 (Lightning) 4A (8/20—s)  
IEC 61000-4-4 (EFT) 40A (5/50ns)  
‹ Package design optimized for high speed lines  
‹ Flow-Through design  
‹ Protects six high-speed lines  
‹ Low capacitance: 0.65pF Maximum (I/O to Ground)  
‹ Low ESD clamping voltage  
‹ Low dynamic resistance: 0.20 Ohms (Typical)  
‹ Solid-state silicon-avalanche technology  
Mechanical Characteristics  
RClamp0516P is in an 8-pin SLP3313P6 package mea-  
suring 3.3 x 1.3mm with a nominal height of 0.575mm.  
The leads have a nominal pin-to-pin pitch of 0.50mm.  
Flow- through package design simplifies PCB layout and  
maintains signal integrity on high-speed lines.  
‹ SLP3313P6 8-pin package (3.3 x 1.3 x 0.575mm)  
‹ Pb-Free, Halogen Free, RoHS/WEEE Compliant  
‹ Lead Pitch: 0.5mm  
‹ Lead finish: NiPdAu  
The combination of low peak ESD clamping, low dynamic  
resistance, and innovative package design enables this  
device to provide the highest level of ESD protection for  
applications such as USB 3.0, HDMI 1.4, and MDDI /  
mipi interfaces.  
‹ Marking: Marking Code  
‹ Packaging: Tape and Reel  
Applications  
‹ USB 3.0  
‹ HDMI 1.4  
‹ uSD Card Interfaces  
‹ MMC Card Interfaces  
‹ MDDI / mipi Interfaces  
Circuit Diagram  
Pin Configuration  
1
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
8
7
GND  
GND  
Pin 1  
Pin 2  
Pin 3  
Pin 4  
Pin 5  
Pin 6  
Pin 7, 8  
6
6-Line Protection  
Top View  
www.semtech.com  
Revision 7/16/2015  
1

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