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R5F2L358MDFP PDF预览

R5F2L358MDFP

更新时间: 2024-11-04 11:57:35
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
75页 877K
描述
R8C/L35M Group, R8C/L36M Group, R8C/L38M Group, R8C/L3AM Group RENESAS MCU

R5F2L358MDFP 数据手册

 浏览型号R5F2L358MDFP的Datasheet PDF文件第2页浏览型号R5F2L358MDFP的Datasheet PDF文件第3页浏览型号R5F2L358MDFP的Datasheet PDF文件第4页浏览型号R5F2L358MDFP的Datasheet PDF文件第5页浏览型号R5F2L358MDFP的Datasheet PDF文件第6页浏览型号R5F2L358MDFP的Datasheet PDF文件第7页 
Datasheet  
R8C/L35M Group, R8C/L36M Group, R8C/L38M Group, R8C/L3AM Group  
RENESAS MCU  
R01DS0028EJ0100  
Rev.1.00  
Jun 28, 2011  
1. Overview  
1.1  
Features  
The R8C/L35M Group, R8C/L36M Group, R8C/L38M Group, and R8C/L3AM Group of single-chip MCUs  
incorporate the R8C CPU core, which implements a powerful instruction set for a high level of efficiency and  
supports a 1 Mbyte address space, allowing execution of instructions at high speed. In addition, the CPU core  
integrates a multiplier for high-speed operation processing.  
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are  
designed to maximize EMI/EMS performance.  
Integration of many peripheral functions, including multifunction timer and serial interface, helps reduce the  
number of system components.  
These groups have data flash (1 KB × 4 blocks) with the background operation (BGO) function.  
1.1.1  
Applications  
Household appliances, office equipment, audio equipment, consumer products, etc.  
R01DS0028EJ0100 Rev.1.00  
Jun 28, 2011  
Page 1 of 72  

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