生命周期: | Active | 零件包装代码: | LGA |
包装说明: | 6 X 6 MM, 0.65 MM PITCH, PLASTIC, TFLGA-64 | 针数: | 64 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.23 | Is Samacsys: | N |
具有ADC: | YES | 其他特性: | ALSO OPERATES AT 2.2V SUPPLY AT 5 MHZ |
地址总线宽度: | 位大小: | 16 | |
最大时钟频率: | 20 MHz | DAC 通道: | YES |
DMA 通道: | NO | 外部数据总线宽度: | |
JESD-30 代码: | S-PBGA-B64 | 长度: | 6 mm |
I/O 线路数量: | 57 | 端子数量: | 64 |
最高工作温度: | 85 °C | 最低工作温度: | -20 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFLGA | 封装等效代码: | BGA64,8X8,25 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
电源: | 2.2/5.5 V | 认证状态: | Not Qualified |
RAM(字节): | 7168 | ROM(单词): | 98304 |
ROM可编程性: | FLASH | 座面最大高度: | 1.05 mm |
速度: | 20 MHz | 子类别: | Microcontrollers |
最大压摆率: | 20 mA | 最大供电电压: | 5.5 V |
最小供电电压: | 3 V | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子形式: | BUTT |
端子节距: | 0.65 mm | 端子位置: | BOTTOM |
宽度: | 6 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
R5F212BCSDFA | RENESAS |
获取价格 |
RENESAS MCU | |
R5F212BCSDFA#W4 | RENESAS |
获取价格 |
IC,MICROCONTROLLER,16-BIT,R8C CPU,CMOS,QFP,64PIN,PLASTIC | |
R5F212BCSDFP | RENESAS |
获取价格 |
MCU | |
R5F212BCSDFP#U0 | RENESAS |
获取价格 |
R8C Series, 2B Group, WDTO, RTC 64P6Q-A; Vcc= 2.2 to 5.5 volts, Temp= -40 to 85 C, datafla | |
R5F212BCSDXXXFA | RENESAS |
获取价格 |
RENESAS MCU R8C FAMILY / R8C/2x SERIES | |
R5F212BCSDXXXFP | RENESAS |
获取价格 |
RENESAS MCU R8C FAMILY / R8C/2x SERIES | |
R5F212BCSNFA | RENESAS |
获取价格 |
RENESAS MCU | |
R5F212BCSNFA#U0 | RENESAS |
获取价格 |
IC,MICROCONTROLLER,16-BIT,R8C CPU,CMOS,QFP,64PIN,PLASTIC | |
R5F212BCSNFA#V2 | RENESAS |
获取价格 |
16-bit Microcontrollers with R8C CPU Core (Non Promotion), LQFP, /Tray | |
R5F212BCSNFA#W4 | RENESAS |
获取价格 |
IC,MICROCONTROLLER,16-BIT,R8C CPU,CMOS,QFP,64PIN,PLASTIC |