Circuit Board Materials
電子回路基板材料
Halogen-free Low transmission loss Highly heat resistant
Multi-layer circuit board materials
ハロゲンフリー低伝送損失・高耐熱多層基板材料
Laminate R-1577 R-1577E
Prepreg R-1570 R-1570E
Applications ⽤途
ICT infrastructure equipment, Measuring instrument, Etc.
ICT インフラ機器、計測機器など
Network
ネットワーク
Halogen-free High Tg material suitable for large volume high speed data
transmission.
ハロゲン系難燃剤など含まない環境対応材で、ボリュームゾーンのサーバ・ルータ
などの更なる高速化に対応
Better
High end zone
Ultra-Low loss
High end/ volume zone
Low loss
Volume zone
Middle Loss
Dk 4.0 Df 0.013
@10GHz
Tg (DSC)
170℃
Halogen-free
Lead-free soldering
■ Frequency dependence by Transmission loss
■ Heat resistance of High Multi-layered
ꢀ高多層耐熱性
Result
ꢀ伝送損失比較
0
●
Drill diameter
φ0.3mm
0.6mm
pass
-20
-40
Wall to wall distance
0.5mm
pass
0.7mm
pass
pass
pass
pass
-60
R-1577
●
●
Condition
-80
R-1577E
260℃ reflow x 10times
-100
Construction
0
5
10
15
Frequency (GHz)
Trace width (w)
Trace thickness (t)
Dielectric thickness (h)
Core
28 Layers
Board thickness: 3.8mm
●
0.1mm
0.035mm
0.28mm
0.13mm
Construction
Stripline
w
t
h
Prepreg
0.06mm x 2ply
Line length
1m
Impedance
50Ω
■ General propertiesꢀ⼀般特性
Item
Test method
DSC
Condition
Unit
℃
R-1577
170
34
R-1577E
Glass transition temp.(Tg)
A
173
35
α1
CTE z-axis
α2
IPC-TM-650 2.4.24
IPC-TM-650 2.4.24.1
IPC-TM-650 2.5.5.5
IPC-TM-650 2.4.8
A
ppm/℃
min
200
25
210
25
T288(with copper)
A
C-24/23/50
A
Dielectric constant(Dk)
10GHz
4.0
4.1
-
Dissipation factor(Df)
0.013
1.3
0.013
1.3
Peel strength
1oz(35μm)
kN/m
The sample thickness is 0.8mm.
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others. 当社ハロゲンフリー材料は、JPCA-ES-01-2003 などの定義によるものです。
The above data are typical values and not guaranteed values. 上記データは当社測定による代表値であり、保証値ではありません。
Please see the page for “Notes before you use” 商品のご採用に当たっての注意事項は こちら
2022
202201
industrial.panasonic.com/ww/electronic-materials
panasonic R-1577