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QTT-138-04-F-T PDF预览

QTT-138-04-F-T

更新时间： 2024-11-02 18:59:23
品牌 Logo 应用领域
申泰 - SAMTEC 连接器
页数 文件大小 规格书
1页 554K
描述
Board Stacking Connector, 114 Contact(s), 3 Row(s), Male, Straight, Solder Terminal, Black Insulator, ROHS COMPLIANT

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QTT-138-04-F-T 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：ROHS COMPLIANT
Reach Compliance Code：compliantFactory Lead Time：2 weeks
风险等级：5.74Samacsys Description：114 position, 2.00 mm Power Plane Terminal Strip
主体宽度：0.236 inch主体深度：0.512 inch
主体长度：3.012 inch连接器类型：BOARD STACKING CONNECTOR
联系完成配合：GOLD FLASH OVER NICKEL联系完成终止：Tin (Sn) - with Nickel (Ni) barrier
触点性别：MALE触点材料：PHOSPHOR BRONZE
触点样式：SQ PIN-SKTDIN 符合性：NO
滤波功能：NOIEC 符合性：NO
绝缘体颜色：BLACK绝缘体材料：LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码：e3MIL 符合性：NO
插接信息：MULTIPLE MATING PARTS AVAILABLE混合触点：NO
安装方式：STRAIGHT安装类型：BOARD
连接器数：ONE装载的行数：3
最高工作温度：125 °C最低工作温度：-55 °C
选件：GENERAL PURPOSE电镀厚度：FLASH inch
参考标准：UL可靠性：COMMERCIAL
子类别：Headers and Edge Type Connectors端子长度：0.09 inch
端子节距：2 mm端接类型：SOLDER
触点总数：114Base Number Matches：1

QTT-138-04-F-T 数据手册

  
F-213 SUPPLEꢁENT  
QST–117–02–G–T  
QTT–117–04–G–5  
(2,00 mm) .0787"  
QTT, QST SERIES  
POWER PLANE TERMINAL & SOCKET  
SPECIFICATIONS  
For complete specifications  
see www.samtec.com?QTT  
or www.samtec.com?QST  
ROW  
OPTION  
LEAD  
STYLE  
PLATING  
OPTION  
NO. PINS  
PER ROW  
1
QTT  
Insulator Material:  
Black Liquid Crystal Polymer  
Terminal Material (QTT):  
Phosphor Bronze  
Specify  
LEAD  
STYLE  
from  
–T  
–G  
= Triple Row  
= 20µ" (0,51 µm)  
Gold on  
10 thru 50  
(Row 2 is Ground Plane)  
Contact Material (QST):  
Phosphor Bronze  
No. of positions x  
contact area  
Gold flash on tail  
(2,00) .0787 + (0,25) .010  
(No. of positions -1)  
x (2,00) .0787  
(1,00)  
.0394  
–5  
Current Rating:  
chart  
3A @ per contact  
= Five Row  
05  
250  
80°C ambient  
(Rows 2 and 4 are Ground Planes)  
–S  
= 30µ" (0,76 µm)  
Gold on  
contact area,  
Tin on tail  
Operating Temp Range:  
-55°C to +105°C with Tin;  
-55°C to +125°C with Gold  
Max Processing Temp:  
230°C for 60 seconds  
Plating:  
LEAD  
STYLE  
A
(No. of  
rows -1)  
x (2,00)  
.0787  
(7,00)  
.276  
–01  
(9,00)  
.355  
Sn or Au over 50µ" (1,27 µm) Ni  
Insertion Force (QST):  
4 oz (1,11 N) avg  
–02  
–03  
–04  
–L  
= 10µ" (0,25 µm)  
Gold on  
(10,00)  
.394  
(11,00)  
.433  
(6,00)  
.236  
01  
246  
Withdrawal Force (QST):  
3 oz (0,837 N) avg  
(0,50) .020 SQ  
contact area,  
Tin on tail  
(13,00)  
.512  
(3,04)  
.120  
Impedance:  
50Ω 5ꢀ @ 170 ꢁMz  
50Ω 20ꢀ @ 253 ꢁMz  
(system @ 50Ω)  
–F  
(2,00)  
.0787  
= Gold flash  
on contact area,  
Tin on tail  
RoHS Compliant: Yes  
A
APPLICATIONS  
(2,29)  
.090  
–T  
–5  
QTT  
SPACING  
QST  
TYPICAL BOARD SPACING  
LEAD  
PLATING  
OPTION  
ROW  
NO. PINS  
1
QST  
QTT  
–01  
–02  
–03  
–04  
QST  
–02  
–02  
–03  
–04  
SPACING  
STYLE  
OPTION  
PER ROW  
(19,71) .776  
(21,72) .855  
(27,51) 1.083  
(32,31) 1.272  
Specify  
LEAD  
STYLE  
from  
–G  
–T  
= 20µ" (0,51 µm)  
Gold on contact area,  
Gold flash on tail  
= Triple Row  
10 thru 50  
(Row 2 is Ground Plane)  
APPLICATION  
SPECIFIC OPTION  
No. of positions x  
(2,00) .07874 + (0,30) .012  
250  
05  
–5  
chart  
= Five Row  
–S  
(Rows 2 and 4 are Ground Planes)  
9A  
= 30µ" (0,76 µm)  
Gold on contact area,  
Tin on tail  
18A  
LEAD  
STYLE  
A
B
ꢁix and  
match power  
(16,21) (5,39)  
.638 .212  
–01  
–L  
(6,00)  
.236  
(10,00)  
.394  
plane and  
246  
01  
= 10µ" (0,25 µm)  
Gold on contact area,  
Tin on tail  
27A  
(12,70) (3,18)  
.500 .125  
–02  
signal pin  
locations  
and size.  
Call Samtec  
for part  
(16,51)  
.650  
–03  
(2,29)  
.090  
(19,30)  
.760  
–F  
–04  
A
= Gold flash on  
contact area,  
Tin on tail  
number.  
Note:  
Some lengths, styles and  
options are non-standard,  
non-returnable.  
B
(2,00)  
.07874  
–T  
–5  
(0,50) .020 SQ  
WWW.SAMTEC.COM  
1

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