Datasheet > QTE-020-07-L-D-A

QTE-020-07-L-D-A

更新时间： 2024-11-11 21:22:11

品牌	Logo	应用领域
申泰 - SAMTEC		PC 连接器
页数	文件大小	规格书
1页	553K
描述
Board Stacking Connector, 40 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT

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技术参数
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QTE-020-07-L-D-A 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	ROHS COMPLIANT
Reach Compliance Code：	compliant	风险等级：	1.68
其他特性：	E.L.P., POLARIZED	主体宽度：	0.235 inch
主体深度：	0.954 inch	主体长度：	0.788 inch
连接器类型：	BOARD STACKING CONNECTOR	联系完成配合：	GOLD (10) OVER NICKEL (50)
联系完成终止：	Matte Tin (Sn) - with Nickel (Ni) barrier	触点性别：	MALE
触点材料：	NOT SPECIFIED	触点模式：	RECTANGULAR
触点样式：	BELLOWED TYPE	DIN 符合性：	NO
滤波功能：	NO	IEC 符合性：	NO
绝缘体材料：	LIQUID CRYSTAL POLYMER	JESD-609代码：	e3
MIL 符合性：	NO	插接触点节距：	0.031 inch
插接信息：	MULTIPLE MATING PARTS AVAILABLE	混合触点：	NO
安装选项1：	LOCKING	安装方式：	STRAIGHT
安装类型：	BOARD	连接器数：	ONE
PCB行数：	2	装载的行数：	2
选件：	GENERAL PURPOSE	PCB接触模式：	RECTANGULAR
PCB触点行间距：	6.17 mm	电镀厚度：	10u inch
参考标准：	UL	端子节距：	0.8 mm
端接类型：	SURFACE MOUNT	触点总数：	40
UL 易燃性代码：	94V-0	Base Number Matches：	1

QTE-020-07-L-D-A 数据手册

F-214

QTE–014–01–F–D–DP–A

QTE–040–01–L–D–A

QTE–060–01–L–D–A

(0,80 mm) .0315"

QTE SERIES

HIGH SPEED GROUND PLANE HEADER

Integral metal plane

for power or ground

Board Mates:

QSE

Standard stack heights

from 5 mm to 25 mm

SPECIFICATIONS

For complete speciﬁcations and

recommended PCB layouts see

www.samtec.com?QTE

Cable Mates:

EQCD, EQDP, EQRF

(See Also Available note)

Insulator Material:

Liquid Crystal Polymer

Terminal Material:

Phosphor Bronze

Plating: Au or Sn over

50µ" (1,27 µm) Ni

Current Rating:

Contact:

2 A per pin

(1 pin powered per row)

Ground Plane:

Rated @ 3dB Insertion Loss

with PCB effects* w/o PCB effects**

11.6 A per ground plane

(1 ground plane powered)

Operating Temp Range:

-55°C to +125°C

QTE/QSE

Type

5 mm Stack Height

Single-Ended Signaling

Differential Pair Signaling

–D

9 GHz / 18 Gbps

8 GHz / 16 Gbps

9 GHz / 18 Gbps

14 GHz / 28 Gbps

Voltage Rating:

225 VAC mated with QSE

& 5 mm Stack Height

Max Cycles: 100

–DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps

*Performance data includes effects of a non-optimized PCB.

**Test board losses de-embedded from performance data.

RoHS Compliant: Yes

Performance data for other stack heights and complete test data

available at www.samtec.com?QTE or contact sig@samtec.com

Processing:

Lead–Free Solderable: Yes

SMT Lead Coplanarity:

(0,10 mm) .004" max (020-060)

Board Stacking:

LEAD

PINS PER ROW

NO. OF PAIRS

PLATING

OPTION

OTHER

OPTION

TYPE

QTE

For applications requiring

more than two connectors per

board contact ipg@samtec.com

STYLE

RECOGNITIONS

Specify

LEAD

STYLE

from

–K

For complete scope

of recognitions see

www.samtec.com/quality

= (7,00 mm)

.275" DIA

Polyimide

Film Pick &

Place Pad

–020, –040, –060

–F

–D

(40 total pins per bank = –D)

= Gold Flash

= Single-Ended

on Signal Pins and

Ground Plane,

Matte Tin on tails

chart

–014, –028, –042

–D–DP

= Differential Pair

(–01 only)

(14 pairs per bank = –D–DP)

FILE NO: 090871_0_000

–TR

= Tape & Reel

Packaging

(N/A –05 & –07

lead style)

ALSO AVAILABLE

–L

–D–DP = (No. of Positions per Row/14)

x (20,00) .7875

= 10µ" (0,25 µm)

Gold on Signal Pins

and Ground Plane,

Matte Tin on tails

(MOQ Required)

–D = (No. of Positions per Row/20)

x (20,00) .7875

QTE

LEAD

STYLE

HEIGHT

WITH

QSE*

• 14mm, 15 mm, 22 mm

and 30 mm stack height

(Caution: Some automatic

placement/inspection

machines may have

component height

restrictions. Please consult

machinery speciﬁcations.)

• 30µ" (0,76 µm) Gold

(Specify -H plating for

Data Rate cable mating

applications.)

(20,00) .7875

–L

(4,27) (5,00)

.168 .197

–C*

–01

–02

–03

–04

–05

–07

= Latching

Option

(5,97)

.235

(7,11)

.280

= Electro-Polished

Selective

(7,26) (8,00)

.286 .315

(N/A on –042 &

–060 positions)

50µ" (1,27 µm) min

Au over 150µ"

(10,27) (11,00)

.404 .433

(0,80)

.0315

(0,20)

.008

(3,81 µm) Ni on Signal

Pins in contact area,

10µ" (0,25 µm) min Au

over 50µ" (1,27 µm) Ni

on Ground Plane

in contact area,

(15,25) (16,00)

.600 .630

(18,26) (19,00)

.718 .748

(24,24) (25,00)

.954 .984

• Edge Mount

• 56 (-DP), 80, 100

positions per row

• Guide Posts, Screw Down

& Friction Lock

• Retention Option

Contact Samtec.

Matte Tin over 50µ"

(1,27 µm) min Ni on

all solder tails

*Processing conditions

will affect mated height.

(0,76)

.030

OTHER

SOLUTIONS

*Note: –C Plating passes

10 year MFG testing

(0,64)

.025

(0,89)

.035 DIA

Note: Some lengths, styles

and options are non-standard,

non-returnable.

• Board Spacing Standoffs.

See SO Series

–L

WWW.SAMTEC.COM

中文翻译

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