F-213
QSH–060–01–L–D–DP–A
®
QSH–060–01–L–D–A–K
(0,50 mm) .0197"
QSH SERIES
QSH–030–01–F–D–A
HIGH SPEED GROUND PLANE SOCKET
Blade &
Beam Design
Integral metal plane
for power or ground
Board Mates:
QTH
SPECIFICATIONS
®
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSH
Cable Mates:
HQCD, HQDP
(See Application Specific note)
Insulator Material:
Liquid Crystal
Polymer
TM
Contact Material:
Phosphor Bronze
Plating:
EXTENDED LIFE PRODUCT
Au or Sn over
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QTH
50µ" (1,27 µm) Ni
Current Rating:
Contact:
1.0A per contact @ 30°C
Temperature Rise
Ground Plane:
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
9 GHz / 18 Gbps 9.5 GHz / 19 Gbps
8 GHz / 16 Gbps 10.5 GHz / 21 Gbps
QTH/QSH
Type
5 mm Stack Height
7.8A per ground plane @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5 mm Stack Height)
Max Cycles:
Single-Ended Signaling
Differential Pair Signaling
Differential Pair Signaling
–D
–D
–DP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
100
Performance data for other stack heights and complete test data
available at www.samtec.com?QSH or contact sig@samtec.com
RoHS Compliant:
Yes
Processing:
PINS PER ROW
PLATING
OTHER
Lead-Free Solderable:
Yes
TYPE
QSH
A
01
NO. OF PAIRS
OPTION
OPTION
SMT Lead Coplanarity:
(0,10 mm) .004" max (030-060)
(0,15 mm) .006" max (090)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
–F
= Gold Flash
–D
= Single-
Ended
–K
–030, –060, –090
on Signal Pins
and Ground Plane,
MatteTin on tails
= (8,25 mm)
.325" DIA
(60 total pins per bank = –D)
APPLICATION
SPECIFIC OPTION
• 14 mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
Polyimide Film
Pick & Place Pad
–020, –040, –060
–D–DP
= Differential
Pair
(20 pairs per bank = –D–DP)
–L
= 10µ" (0,25 µm)
Gold on Signal Pins
and Ground Plane,
MatteTin on tails
–TR
–D = (No. of Pins per Row/30) x
(20,00) .7875 + (1,27) .050
(–01 only)
= Tape & Reel
(–090 positions
maximum)
–DP = (No. of Pairs per Row/20) x
(20,00) .7875 + (1,27) .050
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating for Data
Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 80(-DP), 120, 150
positions per row
• Retention Option
Call Samtec.
–C*
(20,00) .7875
–L
02
= Electro-Polished
Selective
= Latching
Option
QTH
LEAD
MATED
HEIGHT
(7,49)
.295
50µ" (1,27 µm) min Au
over 150µ" (3,81 µm)
Ni on Signal Pins
in contact area,
10µ" (0,25 µm) min Au
over 50µ" (1,27 µm)
Ni on Ground Plane
in contact area,
STYLE WITH QSH*
(N/A on
–060 (–D–DP),
–080, –090 &
–120 positions)
(5,00) .197
–01
–02
–03
–04
–05
–07
01
(0,50)
.0197
(0,15)
.006
(8,00) .315
(11,00) .433
(16,00) .630
(19,00) .748
MatteTin over 50µ"
(1,27 µm) min Ni
on all solder tails
(25,00) .984
(3,25)
.128
(3,05)
.120
*Processing
conditions will
affect mated height.
(7,24)
.285
(0,76)
.030
ALSO
AVAILABLE
*Note: –C Plating passes
10 year MFG testing
(0,89)
.035
DIA
Board Spacing Standoffs.
See SO Series.
(0,64)
.025
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–L
WWW.SAMTEC.COM