Datasheet > QFP11T080-008

QFP11T080-008

更新时间： 2024-11-21 01:17:59

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
8页	469K
描述
QFP (Quad Flat Packages, Gullwing Leads)

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中文翻译

获取价格

数据手册

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QFP11T080-008 数据手册

Series Overview

*QFP (Quad Flat Packages, Gullwing Leads)

SMT Devices

*QFP variations e.g. BQFP...

Series IC51 (Clamshell)

QFP, PQFP, TQFP and MQUAD

0.4mm to 1.27 Pitch

Part Number (Details)

Speciﬁcations

Insulation Resistance:

1,000MΩ min. at 100V DC

807

IC51

064

Dielectric Withstanding Voltage: for 1 minute (socket depended)

Series No.

Contact Resistance: 30mΩ max. at 10mA/20mV max.

Operating Temperature Range: –40°C to +150°C (for type PEI/PSF)

–55°C to +170°C (for type PES)

No. of Contact Pins

–55°C to +170°C (for type PEI)

10,000 insertions min.

Number of Sides

with Contacts

Mating Cycles:

Materials and Finish

Design Number

Housing: Polysulphone (PSF), glass-ﬁlled

Polyethersulphone (PES), glass-ﬁlled

Polyetherimide (PEI), glass-ﬁlled

Contacts: Beryllium Copper (BeCu)

Plating: Gold over Nickel

As speciﬁcations for this product differ by pitch

and material-mix, please contact our Sales Department

for detailed information.

Series IC357 and IC402 (Open Top)

Quad Flat Package (QFP) with 2-Point Contact Type

0.4 to 0.8mm Pitch

Part Number (Details)

Speciﬁcations

Insulation Resistance:

1,000MΩ min. at 500V DC, pitch 0.4 to 0.8

Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.5 to 0.8

Contact Resistance: 30mΩ max. at 10mA/20mV max.

Operating Temperature Range: –40°C to +150°C

100 4 002 *

IC357

Series No.

Mating Cycles:

Contact Force:

10,000 insertions min.

20g to 45g per pin

No. of Contact Pins

Number of Sides

with Contacts

Materials and Finish

Housing: Polyetherimide (PEI), glass-ﬁlled

Polyethersulphone (PES) glass-ﬁlled

Contacts: Beryllium Copper (BeCu)

Design Number

Positioning Pin

Plating:

Gold over Nickel

N = Without Positioning Pin

P = With Positioning Pin

Series IC234 (Open Top)

Quad Flat Package (QFP) with Shoulder Contact Type

0.4 to 0.8mm Pitch

Part Number (Details)

Speciﬁcations

Insulation Resistance:

1,000MΩ min. at 100V DC pitch 0.4, 0.5

1,000MΩ min. at 500V DC pitch 0.65, 0.8

017 *

IC234

120 4

Series No.

Dielectric Withstanding Voltage: 100V AC for 1 minute pitch 0.4, 0.5

500V AC for 1 minute pitch 0.65

700V AC for 1 minute pitch 0.8

No. of Contact Pins

Contact Resistance:

Operating Temperature Range: –40°C to +150°C

Contact Force:

Mating Cycles:

30mΩ max. at 10mA/20mV max.

Number of Sides

with Contacts

20g to 80g per pin

10,000 insertions min.

Design Number

Positioning Pin

Materials and Finish

N = Without Positioning Pin

P = With Positioning Pin

K = Protection Key

Housing: Polyetherimide (PEI), glass-ﬁlled

Polyethersulphone (PES) glass-ﬁlled

Contacts: Beryllium Copper (BeCu)

** Protection Key: Prevents IC from releasing during transportation

Plating:

Gold over Nickel

46 ^{Test Solutions}

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE

–

DIMENSIONS IN MILLIMETER

12 3 4 5 6 7 8

中文翻译

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QFP12T256-001	YAMAICHI	获取价格	IC Socket, QFP256, 256 Contact(s), Solder
QFP208-P-2828A	PANASONIC	获取价格	Digital RGB Processor LSI
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QFP44	ROHM	获取价格	LSI Assembly
QFP-648-SMTN-TT	3M	获取价格	QFP64, IC SOCKET
QFP-648-SMTR-TT	3M	获取价格	QFP64, IC SOCKET
QFP64-P-1414-0.80A	TOSHIBA	获取价格	QFP64
QFP64-P-1414-0.80C	TOSHIBA	获取价格	QFP64

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