5秒后页面跳转
QFP-SD PDF预览

QFP-SD

更新时间: 2024-11-20 03:40:07
品牌 Logo 应用领域
STATSCHIP /
页数 文件大小 规格书
2页 527K
描述
Stacked Die Quad Flat Pack

QFP-SD 数据手册

 浏览型号QFP-SD的Datasheet PDF文件第2页 
QFP-SD  
Stacked Die Quad Flat Pack  
• Stacking of die enables more functionality and  
integration in a conventional QFP package  
FEATURES  
DESCRIPTION  
Combining devices into one package reduces PCB real  
estate and cost  
STATS ChipPAC’s Stacked Die QFP offering includes LQFP-  
SD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die  
low profile QFP. LQFP-ep-SD is an exposed pad version that  
provides enhanced thermal performance. TQFP-ep-SD is a  
thin profile exposed pad version with enhanced thermal  
performance. STATS ChipPAC’s chip stacking technology  
allows the integration of multiple ICs within a single  
package to improve package performance and functionality  
while reducing overall package size and cost. The die to die  
wire bonding capability enables device/signal integration  
to improve electrical performance and reduce overall  
package I/O requirements. STATS ChipPAC’s Stacked Die  
QFPs with nominal package thickness of 1.40mm and  
1.00mm are suitable for a variety of product applications.  
Stacked Die QFP packages are currently available in LQFP,  
LQFP-ep and TQFP-ep configurations, and are offered in  
standard and green/lead-free bill of materials.  
• Increased sub-system performance by integrating  
multiple chips into a single package  
Die to die bonding capability for device/signal  
integration  
• Standard and green/lead-free materials and Pb-free  
plating  
Options for mixed technologies, 2 or more stacked dice  
Fine pitch bonding capability  
Exposed pad provides enhanced thermal performance  
Low profile package thickness of 1.40mm (LQFP-SD and  
LQFP-ep-SD); 1.00mm (TQFP-ep-SD)  
Lead pitch ranges from 0.80mm to 0.40mm  
• Pin count ranges from 32 to 208 leads (LQFP-SD), 64 to  
216 leads (LQFP-ep-SD), 32 to 100 leads (TQFP-ep-SD)  
• JEDEC standard compliant package outlines  
APPLICATIONS  
Suitable for a variety of applications including memory  
integration (ASIC or Logic), chipset integration (Analog/  
Digital), mixed technologies integration (Baseband/RF),  
handheld products (Cellular Phones, Pagers, MP3 Players,  
GPS), consumer electronics (Internet applications, Digital  
Cameras/Camcorders), computers (Network PCs), and PC  
peripherals (Disk Drivers, CD-R/RW, DVD Drivers).  
www.statschippac.com  

与QFP-SD相关器件

型号 品牌 获取价格 描述 数据表
QFP-T80 ROHM

获取价格

LSI Assembly
QFQ1772F FARADAY

获取价格

ANTIALIASING FILTERS
QFQ1772S FARADAY

获取价格

ANTIALIASING FILTERS
QFR1212EHE DELTA

获取价格

QFR 120 x 120 x 38 MM SERIES
QFR1212GHE DELTA

获取价格

QFR 120 x 120 x 38 MM SERIES
QFR1224EHE DELTA

获取价格

QFR 120 x 120 x 38 MM SERIES
QFR1224GHE DELTA

获取价格

QFR 120 x 120 x 38 MM SERIES
QFR1248EHE DELTA

获取价格

QFR 120 x 120 x 38 MM SERIES
QFR1248GHE DELTA

获取价格

QFR 120 x 120 x 38 MM SERIES
QFR4300MAE40 FREESCALE

获取价格

FlexRay Communication Controllers