MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN52 8x8, 0.5P
CASE 485M−01
ISSUE C
DATE 16 FEB 2010
1
52
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30
MM FROM TERMINAL.
D
A
SCALE 2:1
B
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
MILLIMETERS
DIM MIN
MAX
1.00
0.05
0.80
A
A1
A2
A3
b
0.80
0.00
0.60
E
0.20 REF
0.18
0.30
6.80
2X
D
8.00 BSC
0.15
C
D2
E
6.50
6.50
8.00 BSC
2X
E2
e
6.80
0.50 BSC
0.15
C
K
0.20
0.30
---
L
0.50
A2
0.10
0.08
C
C
GENERIC MARKING
DIAGRAM
A
A3 REF
26
A1
1
SEATING PLANE
C
XXXXXXXXX
XXXXXXXXX
AWLYYWWG
D2
14
13
27
52 X L
XXXXXXXXX = Device Code
A
= Assembly Site
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
E2
WL
YY
WW
G
39
1
52
40
52 X K
RECOMMENDED
SOLDERING FOOTPRINT
52 X b NOTE 3
e
0.10 C A
B
8.30
0.05
C
52X
0.62
6.75
8.30
6.75
52X
0.30
PKG
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
98AON12057D
Semiconductor Components IndustriesO, LNLC,S2E00M2 ICONDUCTOR STANDARD
DOCUMENT NUMBER:
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS:
©
1
Case Outline Number:
versions are uncontrolled except when stamped
October, 2002 − Rev. 01O
485M
“CONTROLLED COPY” in red.
NEW STANDARD:
©
Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
1
October, 2002 − Rev. 0
DESCRIPTION: 52 PIN QFN, 8X8, 0.5P
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