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PZU13B2L PDF预览

PZU13B2L

更新时间: 2024-11-16 11:08:39
品牌 Logo 应用领域
安世 - NEXPERIA 测试二极管
页数 文件大小 规格书
12页 255K
描述
Single Zener diodesProduction

PZU13B2L 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:R-PBCC-N2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.51配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
JESD-30 代码:R-PBCC-N2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL最大功率耗散:0.25 W
认证状态:Not Qualified标称参考电压:13 V
表面贴装:YES技术:ZENER
端子面层:Tin (Sn)端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
最大电压容差:2%工作测试电流:5 mA
Base Number Matches:1

PZU13B2L 数据手册

 浏览型号PZU13B2L的Datasheet PDF文件第2页浏览型号PZU13B2L的Datasheet PDF文件第3页浏览型号PZU13B2L的Datasheet PDF文件第4页浏览型号PZU13B2L的Datasheet PDF文件第5页浏览型号PZU13B2L的Datasheet PDF文件第6页浏览型号PZU13B2L的Datasheet PDF文件第7页 
PZUxBL series  
Single Zener diodes in a SOD882 package  
Rev. 2 — 11 November 2019  
Product data sheet  
1. Product profile  
1.1. General description  
General-purpose Zener diodes in a SOD882 leadless ultra small Surface-Mounted Device (SMD)  
plastic package.  
1.2. Features  
Non-repetitive peak rerverse power dissipation: PZSM ≤ 40 W  
Total power dissipation: Ptot ≤ 250 mW  
Tolerance series: B: approximately ±5 %; B2: approximately ±2 %  
Wide working voltage range: nominal 2.4 V to 36 V (E24 range)  
Low reverse current IR range  
Small plastic package suitable for surface-mounted design  
AEC-Q101 qualified  
1.3. Applications  
General regulation functions  
1.4. Quick reference data  
Table 1. Quick reference data  
Symbol  
VF  
Parameter  
Conditions  
Min  
[1] -  
Typ  
Max  
1.1  
40  
Unit  
V
forward voltage  
IF = 100 mA  
-
-
PZSM  
non-repetitive peak  
[2] -  
W
reverse power dissipation  
Ptot  
total power dissipation  
Tamb ≤ 25 °C  
[3] -  
[4] -  
-
-
250  
550  
mW  
mW  
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02  
[2] tp = 100 μs; square wave; Tj = 25 °C prior to surge  
[3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard  
footprint.  
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2.  
 
 
 
 
 
 

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