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PS2581L2-V-E3-W PDF预览

PS2581L2-V-E3-W

更新时间: 2024-11-03 06:21:27
品牌 Logo 应用领域
日电电子 - NEC /
页数 文件大小 规格书
12页 85K
描述
Transistor Output Optocoupler, 1-Element, 5000V Isolation, SURFACE MOUNT, PLASTIC, DIP-4

PS2581L2-V-E3-W 数据手册

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DATA SHEET  
PHOTOCOUPLER  
PS2581L1,PS2581L2  
LONG CREEPAGE TYPE HIGH ISOLATION VOLTAGE  
4-PIN PHOTOCOUPLER  
NEPOC Series−  
DESCRIPTION  
The PS2581L1, PS2581L2 are optically coupled isolators containing a GaAs light emitting diode and an NPN  
silicon phototransistor in a plastic DIP (Dual In-line Package).  
Creepage distance and clearance of leads are over 8 millimeters.  
The PS2581L2 is lead bending type (Gull-wing) for surface mounting.  
FEATURES  
Long creepage and clearance distance (8 mm)  
High isolation voltage (BV = 5 000 Vr.m.s.)  
High collector to emitter voltage (VCEO = 80 V)  
High-speed switching (tr = 3 µs TYP., tf = 5 µs TYP.)  
High current transfer ratio (CTR = 200 % TYP.)  
UL approved: File No. E72422 (S)  
CSA approved: No. CA101391  
BSI approved: No. 8243/8244  
NEMKO approved: No. P97103006  
DEMKO approved: No. 307269  
SEMKO approved: No. 9741154/01  
FIMKO approved: No. 018277  
VDE0884 approved  
ORDERING INFORMATION  
Part Number  
Package  
Safety Standard Approval  
UL, CSA, BSI, NEMKO, DEMKO,  
SEMKO, FIMKO, VDE approved  
Application Part Number*1  
PS2581L1  
PS2581L1  
PS2581L2  
4-pin DIP  
4-pin DIP  
PS2581L2  
(lead bending surface mount)  
PS2581L2-E3, E4  
4-pin DIP taping  
*1 As applying to Safety Standard, following part number should be used.  
The information in this document is subject to change without notice. Before using this document, please confirm that  
this is the latest version.  
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices  
representative for availability and additional information.  
Document No. PN10239EJ01V0DS (1st edition)  
The mark shows major revised points.  
(Previous No. P12809EJ2V0DS00)  
Date Published February 2003 CP(K)  
Printed in Japan  
NEC Compound Semiconductor Devices 1997, 2003  

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