PS17 thru PS1100
Surface Mount Schottky Rectifier
Reverse Voltage 70~100V Forward Current 1.0A
Features
• Super Low VF Schottky barrier diodes
• Low profile, typical thickness 0.8mm
• Low forward voltage drop
• Low leakage current
iSGA
• Moisture sensitivity: level 1, per J-STD-020
• Heatsink structure
(SOD-123HS)
• High temperature soldering guaranteed: 260℃/10 seconds
Typical Applications
For use of fast swiching in RF module, lighting, cellular phone, portable device, power supplies
and other consumer applications.
Maximum Ratings (TA = 25 °C unless otherwise noted)
PS17
PS18
PS19
PS1100
Unit
Parameter
Symbol
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
70
49
70
80
56
80
90
63
90
100
70
V
V
V
A
VRRM
VRMS
VDC
100
1.0
30
IF(AV)
A
IFSM
A2sec
°C
I2t
TJ
3.8
Rating for fusing(t<8.3ms)
- 55 to + 150
- 55 to + 150
Operating junction temperature range
Storage temperature range
TSTG
°C
Electrical Characteristics (TA = 25 °C unless otherwise noted)
PS17
PS18
PS19
PS1100
Unit
Parameter
Test Conditions
Symbol
100
0.80
0.65
1.0
VBR
Minimum Breakdown voltage
Ta=25℃,IR=1mA
IF=1A,Ta=25℃
IF=1A,Ta=125℃
Ta=25℃
Ta=125℃
4.0 V, 1 MHz
Volts
Maximum instantaneous
forward voltage
VF
Maximum DC reverse current
at rated DC blocking voltage
IR
uA
pF
150
28
CJ
Typical junction capacitance
Typical thermal resistance
1)
65
9
juntion to ambient
juntion to lead
RθJA
1)
℃/W
RθJL
2)
35
juntion to case
RθJC
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB
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2016.03-Rev.A