品牌 | Logo | 应用领域 |
三菱 - MITSUBISHI | / | |
页数 | 文件大小 | 规格书 |
6页 | 96K | |
描述 | ||
INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
包装说明: | , MODULE,23LEAD,3.7 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.88 | 模拟集成电路 - 其他类型: | AC MOTOR CONTROLLER |
JESD-30 代码: | R-XDMA-X23 | 功能数量: | 1 |
端子数量: | 23 | 最大输出电流: | 30 A |
封装主体材料: | UNSPECIFIED | 封装等效代码: | MODULE,23LEAD,3.7 |
封装形状: | RECTANGULAR | 封装形式: | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 15,300 V |
认证状态: | Not Qualified | 子类别: | Motion Control Electronics |
最大供电电压 (Vsup): | 16.5 V | 最小供电电压 (Vsup): | 13.5 V |
标称供电电压 (Vsup): | 15 V | 表面贴装: | NO |
技术: | HYBRID | 端子形式: | UNSPECIFIED |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
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TRANSISTOR | IGBT POWER MODULE | 3-PH BRIDGE | 1.2KV V(BR)CES | 15A I(C) | |
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SMD Power Inductor |