PLZ Series
Vishay Semiconductors
www.vishay.com
Zener Diodes Permitting 500 mW Power Dissipation
FEATURES
• Sillicon planar Zener diodes, ultra small
• Low profile DO-219AC (MicroSMF) package
• Low leakage current
1
2
• Excellent stability
• High temperature soldering: 260 °C / 10 s at
20278
terminals
• Wave and reflow solderable (reflow as per
JPC / JEDEC® J-STD 020) (double wave as
per IEC 61760-1)
• AEC-Q101 qualified available
PRIMARY CHARACTERISTICS
• Base P/N-G3 - RoHS-compliant, green, industrial grade
Base P/N-HG3 - RoHS-compliant, green, AEC-Q101 qualified
PARAMETER
VALUE
2.0 to 39
5 to 20
UNIT
V
•
VZ range nom.
Test current IZT
VZ specification
Int. construction
• ESD immunity acc. IEC 61000-4-2 acc. to part table
• Surge performance acc. to part table
mA
Pulse current
Single
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
ORDERING INFORMATION
DEVICE NAME
ORDERING CODE
TAPED UNITS PER REEL
MINIMUM ORDER QUANTITY
PLZ-Series
Part number-G3/H
Part number-HG3/H
4500 per 7" reel (8 mm tape)
22 500 / box
PLZ-Series
PACKAGE
MOLDING COMPOUND
FLAMMABILITY RATING
PACKAGE NAME
WEIGHT
MOISTURE SENSITIVITY LEVEL
SOLDERING CONDITIONS
DO-219AC (MicroSMF)
4.8 mg
UL 94 V-0
MSL level 1 (according J-STD-020)
260 °C / 10 s at terminals
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm, Tamb = 85 °C
Power dissipation
Ptot
500
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm, Tamb = 25 °C
Power dissipation
Power dissipation
Ptot
Ptot
960
340
mW
Mounted on FR4 board with recommended soldering
footpads (reflow)
tp = 8/20 μs acc. IEC 61000-4-5 (PLZ5V1A to PLZ39D)
tp = 8/20 μs acc. IEC 61000-4-5 (PLZ2V0A to PLZ4V7C)
PZSM
PZSM
IZ
100
70
W
W
Non-repetitive peak surge power dissipation
Z-current
Ptot/VZ
150
mA
Junction temperature
Storage temperature range
Tj
°C
Tstg
-55 to +150
THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
RthJA
VALUE
130
UNIT
K/W
K/W
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm
Typ. thermal resistance junction to ambient air
Typ. thermal resistance junction to lead
RthJL
40
ELECTRICAL SPECIFICATIONS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
Forward Voltage
IF = 10 mA
VF
0.8
0.9
V
Rev. 1.2. 29-Nov-16
Document Number: 84830
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000