Document Number: IMXRT1015CEC
Rev. 2, 03/2021
NXP Semiconductors
Data Sheet: Technical Data
MIMXRT1015DAF5A
i.MX RT1015 Crossover
Processors Data Sheet
for Consumer Products
Package Information
Plastic Package
100-Pin LQFP, 14 x 14 mm, 0.5 mm pitch
Ordering Information
See Table 1 on page 4
1 i.MX RT1015 introduction
The i.MX RT1015 is a processor of i.MX RT family
featuring NXP’s advanced implementation of the Arm
1. i.MX RT1015 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 4
2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1. Special signal considerations . . . . . . . . . . . . . . . 12
3.2. Recommended connections for unused analog
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Cortex -M7 core, which operates at speeds up to 500
MHz to provide high CPU performance and real-time
response.
The i.MX RT1015 processor has 128 KB on-chip RAM,
which can be flexibly configured as TCM or
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 14
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 20
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.5. External memory interface . . . . . . . . . . . . . . . . . 36
4.6. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
4.7. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.8. Communication interfaces . . . . . . . . . . . . . . . . . . 51
4.9. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 57
5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 57
5.2. Boot device interface allocation . . . . . . . . . . . . . . 57
6. Package information and contact assignments . . . . . . . 60
6.1. 14 x 14 mm package information . . . . . . . . . . . . 60
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
general-purpose on-chip RAM. The i.MX RT1015
integrates advanced power management module with
DCDC and LDO that reduces complexity of external
power supply and simplifies power sequencing. The
i.MX RT1015 also provides various memory interfaces,
including Quad SPI, and a wide range of connectivity
interfaces including UART, SPI, I2C, and USB; for
connecting peripherals including Bluetooth™, and GPS.
The i.MX RT1015 also has rich audio features, including
SPDIF and I2S audio interface. Various analog IP
integration, including ADC, temperature sensor, etc.
NXP reserves the right to change the production detail specifications as may be required
to permit improvements in the design of its products.
© 2019-2021 NXP B.V.