是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | DIP |
包装说明: | 0.300 INCH, SKINNY, PLASTIC, DIP-28 | 针数: | 28 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.83 |
具有ADC: | YES | 地址总线宽度: | |
位大小: | 8 | 最大时钟频率: | 40 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | R-PDIP-T28 | |
JESD-609代码: | e3 | 长度: | 34.67 mm |
I/O 线路数量: | 44 | 端子数量: | 28 |
片上程序ROM宽度: | 16 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | YES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | DIP |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
RAM(字节): | 3328 | ROM(单词): | 49152 |
ROM可编程性: | FLASH | 座面最大高度: | 5.08 mm |
速度: | 40 MHz | 最大供电电压: | 5.5 V |
最小供电电压: | 2 V | 标称供电电压: | 3 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 7.62 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER |
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