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PIC18LF27J53-E/SP PDF预览

PIC18LF27J53-E/SP

更新时间: 2024-11-08 10:10:15
品牌 Logo 应用领域
美国微芯 - MICROCHIP 微控制器
页数 文件大小 规格书
586页 6192K
描述
28/44-Pin, High-Performance USB Microcontrollers with nanoWatt XLP Technology

PIC18LF27J53-E/SP 技术参数

生命周期:Active零件包装代码:DIP
包装说明:DIP,针数:28
Reach Compliance Code:compliantECCN代码:3A001.A.3
HTS代码:8542.31.00.01风险等级:5.73
具有ADC:YES地址总线宽度:
位大小:8最大时钟频率:48 MHz
DAC 通道:NODMA 通道:YES
外部数据总线宽度:JESD-30 代码:R-PDIP-T28
JESD-609代码:e3长度:34.671 mm
I/O 线路数量:22端子数量:28
最高工作温度:125 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE认证状态:Not Qualified
ROM可编程性:FLASH座面最大高度:5.08 mm
速度:48 MHz最大供电电压:2.75 V
最小供电电压:2 V标称供电电压:2.5 V
表面贴装:NO技术:CMOS
温度等级:AUTOMOTIVE端子面层:MATTE TIN
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL宽度:7.62 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

PIC18LF27J53-E/SP 数据手册

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