是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | SOIC | 包装说明: | 7.50 MM, LEAD FREE, PLASTIC, SOIC-20 |
针数: | 20 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.A.2 | HTS代码: | 8542.31.00.01 |
Factory Lead Time: | 9 weeks | 风险等级: | 1.24 |
Samacsys Confidence: | 3 | Samacsys Status: | Released |
Samacsys PartID: | 160259 | Samacsys Pin Count: | 20 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Small Outline Packages |
Samacsys Footprint Name: | (SO)20-Lead(SOIC) | Samacsys Released Date: | 2015-04-16 09:48:08 |
Is Samacsys: | N | 具有ADC: | YES |
其他特性: | OPERATES AT 1.8 V MINIMUM SUPPLY AT 20 MHZ | 地址总线宽度: | |
位大小: | 8 | CPU系列: | PIC |
最大时钟频率: | 48 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | |
JESD-30 代码: | R-PDSO-G20 | JESD-609代码: | e3 |
长度: | 12.8 mm | 湿度敏感等级: | 1 |
I/O 线路数量: | 17 | 端子数量: | 20 |
片上程序ROM宽度: | 16 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | YES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装等效代码: | SOP20,.4 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 峰值回流温度(摄氏度): | 250 |
电源: | 2/3.3 V | 认证状态: | Not Qualified |
RAM(字节): | 512 | ROM(单词): | 4096 |
ROM可编程性: | FLASH | 座面最大高度: | 2.65 mm |
速度: | 48 MHz | 子类别: | Microcontrollers |
最大压摆率: | 12 mA | 最大供电电压: | 3.6 V |
最小供电电压: | 2.7 V | 标称供电电压: | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 7.5 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
PIC18F13K50-I/SO | MICROCHIP |
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