是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | TFQFP, | 针数: | 80 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.77 |
具有ADC: | YES | 地址总线宽度: | |
位大小: | 8 | 最大时钟频率: | 40 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | S-PQFP-G80 | |
JESD-609代码: | e3 | 长度: | 12 mm |
湿度敏感等级: | 3 | I/O 线路数量: | 66 |
端子数量: | 80 | 片上程序ROM宽度: | 16 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFQFP | 封装形状: | SQUARE |
封装形式: | FLATPACK, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | RAM(字节): | 768 |
ROM(单词): | 4096 | ROM可编程性: | FLASH |
座面最大高度: | 1.2 mm | 速度: | 40 MHz |
最大供电电压: | 5.5 V | 最小供电电压: | 4.2 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | AUTOMOTIVE |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 12 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER | Base Number Matches: | 1 |
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