是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | 10 X 10 MM, 1 MM HEIGHT, 2 MM, LEAD FREE, PLASTIC, TQFP-44 | 针数: | 44 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 13 weeks |
风险等级: | 1.03 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 160145 |
Samacsys Pin Count: | 44 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Quad Flat Packages | Samacsys Footprint Name: | (PT)44-Lead(TQFP) |
Samacsys Released Date: | 2015-04-16 09:48:08 | Is Samacsys: | N |
具有ADC: | YES | 其他特性: | ALSO OPERATES AT 2.15 V MINIUM SUPPLY AT 8 MHZ |
地址总线宽度: | 位大小: | 8 | |
CPU系列: | PIC | 最大时钟频率: | 48 MHz |
DAC 通道: | NO | DMA 通道: | YES |
外部数据总线宽度: | JESD-30 代码: | S-PQFP-G44 | |
JESD-609代码: | e3 | 长度: | 10 mm |
湿度敏感等级: | 1 | I/O 线路数量: | 38 |
端子数量: | 44 | 片上程序ROM宽度: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TQFP | 封装等效代码: | TQFP44,.47SQ,32 |
封装形状: | SQUARE | 封装形式: | FLATPACK, THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 2.5/3.3 V |
认证状态: | Not Qualified | RAM(字节): | 3776 |
ROM(单词): | 32768 | ROM可编程性: | FLASH |
座面最大高度: | 1.2 mm | 速度: | 48 MHz |
子类别: | Microcontrollers | 最大压摆率: | 24.1 mA |
最大供电电压: | 3.6 V | 最小供电电压: | 2.35 V |
标称供电电压: | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) - annealed | 端子形式: | GULL WING |
端子节距: | 0.8 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 10 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER | Base Number Matches: | 1 |
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PIC18F45J11-I/PT | MICROCHIP |
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