是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFN |
包装说明: | 4 X 4 MM, 0.50 MM HEIGHT, LEAD FREE, PLASTIC, UQFN-28 | 针数: | 28 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.3 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.7 |
Is Samacsys: | N | 具有ADC: | YES |
其他特性: | ALSO OPERATES AT 1.8V MINIMUM SUPPLY FOR 20 MHZ | 地址总线宽度: | |
位大小: | 8 | 最大时钟频率: | 64 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | S-PQCC-N28 | |
JESD-609代码: | e3 | 长度: | 4 mm |
湿度敏感等级: | 1 | I/O 线路数量: | 25 |
端子数量: | 28 | 片上程序ROM宽度: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVQCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | RAM(字节): | 3936 |
ROM(单词): | 32768 | ROM可编程性: | FLASH |
座面最大高度: | 0.55 mm | 速度: | 64 MHz |
最大供电电压: | 3.5 V | 最小供电电压: | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | NO LEAD | 端子节距: | 0.4 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 4 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER |
Base Number Matches: | 1 |
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PIC18F26K20-I/SP | MICROCHIP |
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PIC18F26K22-E/MV | MICROCHIP |
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PIC18F26K22-E/P | MICROCHIP |
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PIC18F26K22-E/PT | MICROCHIP |
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28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology |