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PIC18F26K22-E/SP PDF预览

PIC18F26K22-E/SP

更新时间: 2024-11-08 06:03:31
品牌 Logo 应用领域
美国微芯 - MICROCHIP 微控制器和处理器外围集成电路光电二极管时钟
页数 文件大小 规格书
494页 5012K
描述
28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology

PIC18F26K22-E/SP 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:DIP包装说明:0.300 INCH, LEAD FREE, PLASTIC, SDIP-28
针数:28Reach Compliance Code:compliant
ECCN代码:3A991.A.2HTS代码:8542.31.00.01
Factory Lead Time:9 weeks风险等级:5.24
具有ADC:YES其他特性:ALSO OPERATES 2.3V MINIMUM SUPPLY AT 16 MHZ
地址总线宽度:位大小:8
CPU系列:PIC最大时钟频率:64 MHz
DAC 通道:YESDMA 通道:NO
外部数据总线宽度:JESD-30 代码:R-PDIP-T28
JESD-609代码:e3长度:34.671 mm
I/O 线路数量:25端子数量:28
片上程序ROM宽度:16最高工作温度:125 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP28,.3封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT APPLICABLE
电源:2/5 V认证状态:Not Qualified
RAM(字节):3896ROM(单词):32768
ROM可编程性:FLASH座面最大高度:5.08 mm
速度:48 MHz子类别:Microcontrollers
最大压摆率:12 mA最大供电电压:5.5 V
最小供电电压:2.7 V标称供电电压:5 V
表面贴装:NO技术:CMOS
温度等级:AUTOMOTIVE端子面层:Matte Tin (Sn) - annealed
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT APPLICABLE
宽度:7.62 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

PIC18F26K22-E/SP 数据手册

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PIC18(L)F2X/4XK22  
Data Sheet  
28/40/44-Pin, Low-Power,  
High-Performance Microcontrollers  
with nanoWatt XLP Technology  
2010 Microchip Technology Inc.  
Preliminary  
DS41412A  

PIC18F26K22-E/SP 替代型号

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