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PIC18F25K22-I/SS PDF预览

PIC18F25K22-I/SS

更新时间: 2024-11-08 06:03:31
品牌 Logo 应用领域
美国微芯 - MICROCHIP 微控制器
页数 文件大小 规格书
494页 5012K
描述
28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology

PIC18F25K22-I/SS 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SSOP
包装说明:SSOP, SSOP28,.3针数:28
Reach Compliance Code:compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:0.81
具有ADC:YES其他特性:ALSO OPERATES 2.3 V MINIMUM SUPPLY AT 20 MHZ
地址总线宽度:位大小:8
CPU系列:PIC最大时钟频率:64 MHz
DAC 通道:YESDMA 通道:NO
外部数据总线宽度:JESD-30 代码:R-PDSO-G28
JESD-609代码:e3长度:10.2 mm
湿度敏感等级:2I/O 线路数量:25
端子数量:28片上程序ROM宽度:16
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装等效代码:SSOP28,.3
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度):260电源:2/5 V
认证状态:Not QualifiedRAM(字节):1536
ROM(单词):16384ROM可编程性:FLASH
座面最大高度:2 mm速度:64 MHz
子类别:Microcontrollers最大压摆率:12 mA
最大供电电压:5.5 V最小供电电压:2.7 V
标称供电电压:5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40宽度:5.3 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISCBase Number Matches:1

PIC18F25K22-I/SS 数据手册

 浏览型号PIC18F25K22-I/SS的Datasheet PDF文件第2页浏览型号PIC18F25K22-I/SS的Datasheet PDF文件第3页浏览型号PIC18F25K22-I/SS的Datasheet PDF文件第4页浏览型号PIC18F25K22-I/SS的Datasheet PDF文件第5页浏览型号PIC18F25K22-I/SS的Datasheet PDF文件第6页浏览型号PIC18F25K22-I/SS的Datasheet PDF文件第7页 
PIC18(L)F2X/4XK22  
Data Sheet  
28/40/44-Pin, Low-Power,  
High-Performance Microcontrollers  
with nanoWatt XLP Technology  
2010 Microchip Technology Inc.  
Preliminary  
DS41412A  

PIC18F25K22-I/SS 替代型号

型号 品牌 替代类型 描述 数据表
PIC18F25K22-E/SS MICROCHIP

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28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology
PIC18F26K22-I/SS MICROCHIP

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28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology
PIC18F24K22-I/SS MICROCHIP

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28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology

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