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PIC18F2523-E/SP PDF预览

PIC18F2523-E/SP

更新时间: 2024-11-08 15:47:59
品牌 Logo 应用领域
美国微芯 - MICROCHIP 微控制器光电二极管
页数 文件大小 规格书
54页 502K
描述
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,28PIN,PLASTIC

PIC18F2523-E/SP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DIP
针数:28Reach Compliance Code:compliant
ECCN代码:3A991.A.2HTS代码:8542.31.00.01
Factory Lead Time:5 weeks风险等级:5.3
位大小:8CPU系列:PIC
JESD-30 代码:R-PDIP-T28JESD-609代码:e3
端子数量:28最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP28,.3
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT APPLICABLE电源:5 V
认证状态:Not QualifiedRAM(字节):1536
ROM(单词):32768ROM可编程性:FLASH
速度:40 MHz子类别:Microcontrollers
标称供电电压:5 V表面贴装:NO
技术:CMOS温度等级:AUTOMOTIVE
端子面层:Matte Tin (Sn) - annealed端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT APPLICABLEBase Number Matches:1

PIC18F2523-E/SP 数据手册

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PIC18F2423/2523/4423/4523  
Data Sheet  
28/40/44-Pin, Enhanced Flash  
Microcontrollers with 12-Bit A/D  
and nanoWatt Technology  
© 2009 Microchip Technology Inc.  
DS39755C  

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