是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | LCC |
包装说明: | QCCJ, LDCC68,1.0SQ | 针数: | 68 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 30 weeks |
风险等级: | 5.16 | 具有ADC: | YES |
地址总线宽度: | 16 | 位大小: | 8 |
CPU系列: | PIC | 最大时钟频率: | 8 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | 8 | JESD-30 代码: | S-PQCC-J68 |
JESD-609代码: | e3 | 长度: | 24.23 mm |
湿度敏感等级: | 3 | I/O 线路数量: | 50 |
端子数量: | 68 | 片上程序ROM宽度: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | QCCJ | 封装等效代码: | LDCC68,1.0SQ |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER |
峰值回流温度(摄氏度): | 245 | 电源: | 3.3/5 V |
认证状态: | Not Qualified | RAM(字节): | 902 |
ROM(单词): | 16384 | ROM可编程性: | OTPROM |
座面最大高度: | 4.57 mm | 速度: | 8 MHz |
子类别: | Microcontrollers | 最大压摆率: | 12 mA |
最大供电电压: | 5.5 V | 最小供电电压: | 3 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | J BEND |
端子节距: | 1.27 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 24.23 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC | Base Number Matches: | 1 |
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