是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | SOIC |
包装说明: | SOP, SOP18,.4 | 针数: | 18 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 7.5 |
Samacsys Confidence: | 3 | Samacsys Status: | Released |
Samacsys PartID: | 160816 | Samacsys Pin Count: | 18 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Small Outline Packages |
Samacsys Footprint Name: | SO 300mil (SOIC) | Samacsys Released Date: | 2015-05-24 21:47:42 |
Is Samacsys: | N | 具有ADC: | NO |
地址总线宽度: | 位大小: | 8 | |
CPU系列: | PIC | 最大时钟频率: | 4 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | R-PDSO-G18 | |
JESD-609代码: | e3 | 长度: | 11.55 mm |
湿度敏感等级: | 1 | I/O 线路数量: | 13 |
端子数量: | 18 | 片上程序ROM宽度: | 14 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | NO | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装等效代码: | SOP18,.4 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | 260 | 电源: | 3.3/5 V |
认证状态: | Not Qualified | RAM(字节): | 128 |
ROM(单词): | 2048 | ROM可编程性: | OTPROM |
座面最大高度: | 2.64 mm | 速度: | 1 MHz |
子类别: | Microcontrollers | 最大供电电压: | 5.5 V |
最小供电电压: | 3 V | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) - annealed |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 7.5 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
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