是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | DIP |
包装说明: | WDIP, | 针数: | 18 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.65 | Is Samacsys: | N |
具有ADC: | YES | 地址总线宽度: | |
位大小: | 8 | 最大时钟频率: | 20 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | R-GDIP-T18 | |
JESD-609代码: | e3 | 长度: | 22.86 mm |
I/O 线路数量: | 13 | 端子数量: | 18 |
片上程序ROM宽度: | 14 | 最高工作温度: | 70 °C |
最低工作温度: | PWM 通道: | YES | |
封装主体材料: | CERAMIC, GLASS-SEALED | 封装代码: | WDIP |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE, WINDOW |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
RAM(字节): | 128 | ROM(单词): | 1024 |
ROM可编程性: | UVPROM | 座面最大高度: | 4.83 mm |
速度: | 20 MHz | 最大供电电压: | 5.5 V |
最小供电电压: | 4 V | 标称供电电压: | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | MATTE TIN |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 7.62 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
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