是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | DIP |
包装说明: | DIP, DIP18,.3 | 针数: | 18 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 5.16 | Samacsys Confidence: | |
Samacsys Status: | Released | Samacsys PartID: | 587023 |
Samacsys Pin Count: | 18 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Other | Samacsys Footprint Name: | DIP254P762X483-18 |
Samacsys Released Date: | 2017-01-11 17:13:05 | Is Samacsys: | N |
具有ADC: | YES | 其他特性: | ALSO OPERATES AT 4V MINIMUM SUPPLY AT 4 MHZ |
地址总线宽度: | 位大小: | 8 | |
CPU系列: | PIC | 最大时钟频率: | 20 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | R-PDIP-T18 | |
JESD-609代码: | e3 | 长度: | 22.8 mm |
I/O 线路数量: | 13 | 端子数量: | 18 |
片上程序ROM宽度: | 14 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | YES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | DIP |
封装等效代码: | DIP18,.3 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 5 V | 认证状态: | Not Qualified |
RAM(字节): | 128 | ROM(单词): | 1024 |
ROM可编程性: | OTPROM | 座面最大高度: | 4.32 mm |
速度: | 20 MHz | 子类别: | Microcontrollers |
最大压摆率: | 8 mA | 最大供电电压: | 5.5 V |
最小供电电压: | 4.5 V | 标称供电电压: | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 7.62 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
PIC16C712-20E/P | MICROCHIP |
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PIC16C712-20/P | MICROCHIP |
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