是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | DIP |
包装说明: | 0.300 INCH, PLASTIC, MS-001, DIP-18 | 针数: | 18 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.57 | Is Samacsys: | N |
具有ADC: | NO | 地址总线宽度: | |
位大小: | 8 | 最大时钟频率: | 10 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | R-PDIP-T18 | |
JESD-609代码: | e3 | 长度: | 22.8 mm |
I/O 线路数量: | 12 | 端子数量: | 18 |
片上程序ROM宽度: | 12 | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | PWM 通道: | NO |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | DIP |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
RAM(字节): | 25 | ROM(单词): | 1024 |
ROM可编程性: | OTPROM | 座面最大高度: | 4.32 mm |
速度: | 16 MHz | 最大供电电压: | 5.5 V |
最小供电电压: | 4.5 V | 标称供电电压: | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | AUTOMOTIVE | 端子面层: | Matte Tin (Sn) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 7.62 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
PIC16C56-HSE/PXXX | MICROCHIP |
获取价格 |
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,18PIN,PLASTIC | |
PIC16C56-HSE/SOXXX | MICROCHIP |
获取价格 |
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,SOP,18PIN,PLASTIC | |
PIC16C56-HSE/SS | MICROCHIP |
获取价格 |
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,SSOP,20PIN,PLASTIC | |
PIC16C56-HSESO | MICROCHIP |
获取价格 |
8-BIT, OTPROM, 20 MHz, RISC MICROCONTROLLER, PDSO18, 0.300 INCH, PLASTIC, MS-013, SO-18 | |
PIC16C56-HSI/P | ETC |
获取价格 |
IC-8-BIT MCU | |
PIC16C56-HSI/P301 | MICROCHIP |
获取价格 |
8-BIT, OTPROM, 20 MHz, RISC MICROCONTROLLER, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | |
PIC16C56-HSI/PXXX | MICROCHIP |
获取价格 |
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,18PIN,PLASTIC | |
PIC16C56-HSI/SO | ETC |
获取价格 |
IC-SM-8-BIT MCU | |
PIC16C56-HSI/SOXXX | MICROCHIP |
获取价格 |
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,SOP,18PIN,PLASTIC | |
PIC16C56-HSI/SS | ETC |
获取价格 |
IC-SM-8-BIT MCU |