Datasheet > PG-TSDSON-8-26_15

PG-TSDSON-8-26_15

更新时间： 2024-11-13 01:16:31

品牌	Logo	应用领域
英飞凌 - INFINEON		/
页数	文件大小	规格书
1页	33K
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Material Content Data Sheet

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PG-TSDSON-8-26_15 数据手册

Material Content Data Sheet

Sales Product Name BSZ013NE2LS5I

Issued

7. September 2015

MA#

MA001301102

Package

PG-TSDSON-8-26

Weight*

35.85 mg

Average

Mass

[%]

Average

CAS#

Weight

[mg]

Sum

[%]

Sum

Construction Element

Material Group

Substances

Mass

[ppm]

if applicable

[ppm]

chip

inorganic material

non noble metal

organic material

plastics

silicon

phosphorus

zinc

7440-21-3

7723-14-0

7440-66-6

7439-89-6

7440-50-8

1333-86-4

0.629

0.004

0.015

0.291

11.804

0.013

0.035

1.805

15.680

0.400

0.020

0.023

0.019

0.895

0.001

0.005

0.101

4.112

1.75

0.01

0.04

0.81

32.93

0.04

0.10

5.03

43.73

1.12

0.06

0.07

0.05

2.50

0.00

0.01

0.28

11.47

1.75

17547

101

17547

leadframe

405

iron

8109

329253

354

copper

carbon black

epoxy resin

silicondioxide

tin

33.79

0.04

337868

354

wire

encapsulation

977

50333

437356

11163

567

inorganic material

non noble metal

noble metal

60676-86-0

7440-31-5

7440-22-4

7440-31-5

7439-92-1

7723-14-0

7440-66-6

7439-89-6

7440-50-8

48.86

1.12

0.06

488666

11163

567

leadfinish

plating

silver

solder

noble metal

silver

653

non noble metal

inorganic material

non noble metal

< 10%

tin

523

lead

2.62

24952

26128

heat sink CLIP

*deviation

phosphorus

zinc

141

iron

2825

114706

copper

11.76

117707

Sum in total: 100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption

7a, Lead in high melting temperature type solders.

Company

Address

Internet

Infineon Technologies AG

81726 München

www.infineon.com

中文翻译

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