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PF6 PDF预览

PF6

更新时间: 2024-01-20 18:10:26
品牌 Logo 应用领域
固锝 - GOOD-ARK /
页数 文件大小 规格书
4页 379K
描述
Surface Mount Glass Passivated Fast Recovery Rectifier

PF6 数据手册

 浏览型号PF6的Datasheet PDF文件第2页浏览型号PF6的Datasheet PDF文件第3页浏览型号PF6的Datasheet PDF文件第4页 
PF1 thru PF7  
Surface Mount Glass Passivated Fast Recovery Rectifier  
Reverse Voltage 50~1000V Forward Current 1A  
Features  
• Glass passivated fast recovery rectifiers  
• Heatsink structure  
• Low profile, typical thickness 0.8mm  
• Low forward voltage drop  
• Low leakage current  
• Moisture sensitivity: level 1, per J-STD-020  
• Solder dip 260 °C, 10 s  
iSGA  
(SOD-123HS)  
Typical Applications  
For use of general purpose rectification in lighting, cellular phone, portable device, power supplies,  
and other consumer applications.  
Maximum Ratings (TA = 25 °C unless otherwise noted)  
PF1 PF2 PF3 PF4 PF5 PF6 PF7 Unit  
Parameter  
Symbol  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
Maximum DC blocking voltage  
50  
35  
50  
100 200 400 600 800 1000  
70 140 280 420 560 700  
V
V
V
A
VRRM  
VRMS  
VDC  
100 200 400 600 800 1000  
1.0  
Maximum average forward rectified current  
IF(AV)  
Peak forward surge current 8.3 ms single half  
sine-wave superimposed on rated load  
30  
3.8  
A
A2sec  
°C  
IFSM  
I2t  
Rating for fusing(t8.3ms)  
TJ,  
TSTG  
- 55 to + 150  
Operating junction and storage temperature range  
Electrical Characteristics (TA = 25 °C unless otherwise noted)  
PF1 PF2 PF3 PF4 PF5 PF6 PF7 Unit  
Parameter  
Test Conditions  
Symbol  
400  
1000  
VBR  
Ta=25℃,IR=100uA  
IF=1 A,Ta=25  
IF=1 A,Ta=125℃  
600  
Minimum Breakdown voltage  
1.3  
V
Maximum instantaneous  
forward voltage  
VF  
0.98  
5.0  
50  
TA=25  
TA=125℃  
Maximum DC reverse current  
at rated DC blocking voltage  
IR  
µA  
IF=0.5A,IR=1.0A,  
Maximum reverse recovery  
time  
trr  
150  
250  
nS  
pF  
Irr=0.25A  
7.5  
63  
9
CJ  
Typical junction capacitance 4.0 V, 1 MHz  
juntion to ambient  
1)  
RθJA  
1)  
℃/W  
Typical thermal resistance  
juntion to lead  
juntion to case  
RθJL  
2)  
39  
RθJC  
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB  
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB  
www.goodark.com  
1/4  
2016.03-Rev.A  

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