PF1 thru PF7
Surface Mount Glass Passivated Fast Recovery Rectifier
Reverse Voltage 50~1000V Forward Current 1A
Features
• Glass passivated fast recovery rectifiers
• Heatsink structure
• Low profile, typical thickness 0.8mm
• Low forward voltage drop
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
iSGA
(SOD-123HS)
Typical Applications
For use of general purpose rectification in lighting, cellular phone, portable device, power supplies,
and other consumer applications.
Maximum Ratings (TA = 25 °C unless otherwise noted)
PF1 PF2 PF3 PF4 PF5 PF6 PF7 Unit
Parameter
Symbol
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
50
35
50
100 200 400 600 800 1000
70 140 280 420 560 700
V
V
V
A
VRRM
VRMS
VDC
100 200 400 600 800 1000
1.0
Maximum average forward rectified current
IF(AV)
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
30
3.8
A
A2sec
°C
IFSM
I2t
Rating for fusing(t<8.3ms)
TJ,
TSTG
- 55 to + 150
Operating junction and storage temperature range
Electrical Characteristics (TA = 25 °C unless otherwise noted)
PF1 PF2 PF3 PF4 PF5 PF6 PF7 Unit
Parameter
Test Conditions
Symbol
400
1000
VBR
Ta=25℃,IR=100uA
IF=1 A,Ta=25℃
IF=1 A,Ta=125℃
600
Minimum Breakdown voltage
1.3
V
Maximum instantaneous
forward voltage
VF
0.98
5.0
50
TA=25℃
TA=125℃
Maximum DC reverse current
at rated DC blocking voltage
IR
µA
IF=0.5A,IR=1.0A,
Maximum reverse recovery
time
trr
150
250
nS
pF
Irr=0.25A
7.5
63
9
CJ
Typical junction capacitance 4.0 V, 1 MHz
juntion to ambient
1)
RθJA
1)
℃/W
Typical thermal resistance
juntion to lead
juntion to case
RθJL
2)
39
RθJC
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB
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2016.03-Rev.A