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PF157 PDF预览

PF157

更新时间: 2024-11-07 01:24:47
品牌 Logo 应用领域
固锝 - GOOD-ARK /
页数 文件大小 规格书
4页 366K
描述
Surface Mount Glass Passivated Fast Recovery Rectifier

PF157 数据手册

 浏览型号PF157的Datasheet PDF文件第2页浏览型号PF157的Datasheet PDF文件第3页浏览型号PF157的Datasheet PDF文件第4页 
PF151 thru PF157  
Surface Mount Glass Passivated Fast Recovery Rectifier  
Reverse Voltage 50~1000V Forward Current 1.5A  
Features  
• Glass passivated fast recovery rectifiers  
• Heatsink structure  
• Low profile, typical thickness 0.8mm  
• Low forward voltage drop  
• Low leakage current  
• Moisture sensitivity: level 1, per J-STD-020  
• Solder dip 260 °C, 10 s  
iSGA  
(SOD-123HS)  
Typical Applications  
For use of general purpose rectification in lighting, cellular phone, portable device, power  
supplies and other consumer applications.  
Maximum Ratings (TA = 25 °C unless otherwise noted)  
PF151 PF152 PF153 PF154 PF155 PF156 PF157 Unit  
Parameter  
Symbol  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
Maximum DC blocking voltage  
50  
35  
50  
100  
70  
200  
140  
200  
400  
280  
400  
1.5  
600  
420  
600  
800 1000  
560 700  
800 1000  
V
V
V
A
VRRM  
VRMS  
VDC  
100  
Maximum average forward rectified current  
IF(AV)  
Peak forward surge current 8.3 ms single half  
sine-wave superimposed on rated load  
52  
A
IFSM  
I2t  
A2sec  
°C  
11.3  
Rating for fusing(t8.3ms)  
TJ,  
TSTG  
- 55 to + 150  
Operating junction and storage temperature range  
Electrical Characteristics (TA = 25 °C unless otherwise noted)  
PF151 PF152 PF153 PF154 PF155 PF156 PF157 Unit  
Parameter  
Test Conditions  
Symbol  
400  
1000  
VBR  
600  
Minimum Breakdown voltage Ta=25℃,IR=100uA  
V
Maximum instantaneous  
IF=1.5 A,TA=25℃  
forward voltage  
1.3  
VF  
IR  
5.0  
TA=25℃  
Maximum DC reverse current  
at rated DC blocking voltage  
µA  
100  
TA=125℃  
IF=0.5A,IR=1.0A,  
Maximum reverse recovery  
time  
trr  
150  
250  
nS  
pF  
Irr=0.25A  
7.5  
60  
10  
35  
CJ  
Typical junction capacitance 4.0 V, 1 MHz  
juntion to ambient  
1)  
RθJA  
1)  
℃/W  
Typical thermal resistance  
juntion to lead  
juntion to case  
RθJL  
2)  
RθJC  
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB  
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB  
www.goodark.com  
1/4  
2016.05-Rev.A  

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