PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M
PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M
STANDARD HIGH-SPEED PAL CIRCUITS
SRPS016 – D2705, FEBRUARY 1984 – REVISED MARCH 1992
PAL16L8’
J OR W PACKAGE
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Choice of Operating Speeds
High-Speed, A Devices . . . 25 MHz Min
Half-Power, A-2 Devices . . . 16 MHz Min
(TOP VIEW)
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Choice of Input/Output Configuration
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CC
Package Options Include Both Ceramic DIP
and Chip Carrier in Addition to Ceramic
Flat Package
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PORT
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3-STATE
REGISTERED
Q OUTPUTS
DEVICE
INPUTS O OUTPUTS
PAL16L8
PAL16R4
PAL16R6
PAL16R8
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4 (3-state buffers)
6 (3-state buffers)
8 (3-state buffers)
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GND
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description
PAL16L8’
FK PACKAGE
These programmable array logic devices feature
high speed and a choice of either standard or
half-power devices. They combine Advanced
Low-Power Schottky technology with proven
titanium-tungsten fuses. These devices will
provide reliable, high-performance substitutes for
(TOP VIEW)
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conventional
TTL
logic.
Their
easy
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programmabilityallowforquickdesignof”custom”
functions and typically results in a more compact
circuit board. In addition, chip carriers are
available for further reduction in board space.
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The Half-Power versions offer a choice of
operating frequency, switching speeds, and
power dissipation. In many cases, these
Half-Power devices can result in significant power
reduction from an overall system level.
The PAL16’ M series is characterized for
operation over the full military temperature range
of –55°C to 125°C.
PAL is a registered trademark of Advanced Micro Devices Inc.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 1992, Texas Instruments Incorporated
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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