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8103608RA PDF预览

8103608RA

更新时间: 2024-11-01 23:13:59
品牌 Logo 应用领域
德州仪器 - TI 可编程逻辑器件输入元件
页数 文件大小 规格书
18页 355K
描述
STANDARD HIGH-SPEED PAL CIRCUITS

8103608RA 技术参数

生命周期:Active零件包装代码:DIP
包装说明:DIP, DIP20,.3针数:20
Reach Compliance Code:not_compliantECCN代码:3A001.A.2.C
HTS代码:8542.39.00.01风险等级:5.19
架构:PAL-TYPE最大时钟频率:25 MHz
系统内可编程:NOJESD-30 代码:R-GDIP-T20
JTAG BST:NO长度:24.2 mm
专用输入次数:8I/O 线路数量:
输入次数:8输出次数:8
产品条款数:64端子数量:20
最高工作温度:125 °C最低工作温度:-55 °C
组织:8 DEDICATED INPUTS, 0 I/O输出函数:REGISTERED
封装主体材料:CERAMIC, GLASS-SEALED封装代码:DIP
封装等效代码:DIP20,.3封装形状:RECTANGULAR
封装形式:IN-LINE包装方法:TUBE
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
可编程逻辑类型:OT PLD传播延迟:25 ns
认证状态:Qualified筛选级别:MIL-STD-883
座面最大高度:5.08 mm子类别:Programmable Logic Devices
最大供电电压:5.5 V最小供电电压:4.5 V
标称供电电压:5 V表面贴装:NO
技术:TTL温度等级:MILITARY
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:6.92 mmBase Number Matches:1

8103608RA 数据手册

 浏览型号8103608RA的Datasheet PDF文件第2页浏览型号8103608RA的Datasheet PDF文件第3页浏览型号8103608RA的Datasheet PDF文件第4页浏览型号8103608RA的Datasheet PDF文件第5页浏览型号8103608RA的Datasheet PDF文件第6页浏览型号8103608RA的Datasheet PDF文件第7页 
PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M  
PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M  
STANDARD HIGH-SPEED PAL CIRCUITS  
SRPS016 – D2705, FEBRUARY 1984 – REVISED MARCH 1992  
PAL16L8’  
J OR W PACKAGE  
Choice of Operating Speeds  
High-Speed, A Devices . . . 25 MHz Min  
Half-Power, A-2 Devices . . . 16 MHz Min  
(TOP VIEW)  
Choice of Input/Output Configuration  
I
I
I
I
I
I
I
I
I
V
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
CC  
Package Options Include Both Ceramic DIP  
and Chip Carrier in Addition to Ceramic  
Flat Package  
O
I/O  
17 I/O  
16 I/O  
15 I/O  
14 I/O  
13 I/O  
I/O  
PORT  
S
I
3-STATE  
REGISTERED  
Q OUTPUTS  
DEVICE  
INPUTS O OUTPUTS  
PAL16L8  
PAL16R4  
PAL16R6  
PAL16R8  
10  
8
2
0
0
0
0
6
4
2
0
4 (3-state buffers)  
6 (3-state buffers)  
8 (3-state buffers)  
12  
11  
O
I
8
GND  
8
description  
PAL16L8’  
FK PACKAGE  
These programmable array logic devices feature  
high speed and a choice of either standard or  
half-power devices. They combine Advanced  
Low-Power Schottky technology with proven  
titanium-tungsten fuses. These devices will  
provide reliable, high-performance substitutes for  
(TOP VIEW)  
3
2 1 20 19  
I/O  
I/O  
I/O  
I/O  
I/O  
I
I
I
I
I
conventional  
TTL  
logic.  
Their  
easy  
18  
17  
16  
15  
14  
4
5
6
7
8
programmabilityallowforquickdesignofcustom”  
functions and typically results in a more compact  
circuit board. In addition, chip carriers are  
available for further reduction in board space.  
9 10 11 12 13  
The Half-Power versions offer a choice of  
operating frequency, switching speeds, and  
power dissipation. In many cases, these  
Half-Power devices can result in significant power  
reduction from an overall system level.  
The PAL16’ M series is characterized for  
operation over the full military temperature range  
of –55°C to 125°C.  
PAL is a registered trademark of Advanced Micro Devices Inc.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
Copyright 1992, Texas Instruments Incorporated  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
1

8103608RA 替代型号

型号 品牌 替代类型 描述 数据表
5962-8515506RA TI

完全替代

LOW-POWER HIGH-PERFORMANCE IMPACT
PAL16R8AMJ TI

完全替代

STANDARD HIGH-SPEED PAL CIRCUITS

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