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PACDN2404CG PDF预览

PACDN2404CG

更新时间: 2024-09-25 21:22:27
品牌 Logo 应用领域
CALMIRCO 局域网二极管
页数 文件大小 规格书
7页 157K
描述
Trans Voltage Suppressor Diode, Bidirectional, 4 Element, Silicon, 1.80 X 1.15 MM, 0.64 HEIGHT, LEAD FREE, CSP-6

PACDN2404CG 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:CSP包装说明:R-PBGA-B6
针数:6Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.84配置:COMMON BIPOLAR TERMINAL, 4 ELEMENTS
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码:R-PBGA-B6JESD-609代码:e1
元件数量:4端子数量:6
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:GRID ARRAY峰值回流温度(摄氏度):250
极性:BIDIRECTIONAL认证状态:Not Qualified
表面贴装:YES技术:AVALANCHE
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

PACDN2404CG 数据手册

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PACDN2404C/2408C/2416C  
ESD Protection Arrays, Chip Scale Package  
Features  
Product Description  
4, 8, or 16 transient voltage suppressors in a single  
package  
In-system Electrostatic Discharge (ESD) protection  
to +18kV contact discharge per IEC 61000-4-2  
international standard  
The PACDN2404C, PACDN2408C and PACDN2416C  
are transient voltage suppressor arrays that provide a  
very high level of protection for sensitive electronic  
components that may be subjected to ESD. The back-  
to-back Zener connections provide ESD protection in  
cases where nodes with AC signals are present.  
Supports AC signal applications  
Compact Chip Scale Package (0.65mm pitch) for-  
mat saves board space and eases layout in space  
critical applications compared to discrete solutions  
and traditional wire bonded packages  
Lead-free versions available  
These devices are designed and characterized to  
safely dissipate ESD strikes at levels well beyond the  
maximum requirements set forth in the IEC 61000-4-2  
international standard (Level 4, +8kV contact dis-  
charge). All I/Os are rated at +18kV using the IEC  
61000-4-2 contact discharge method. Using the MIL-  
STD-883D (Method 3015) specification for Human  
Body Model (HBM) ESD, all pins are protected for con-  
tact discharges to greater than +30kV.  
Applications  
ESD protection for sensitive electronic equipment  
I/O port, keypad and button circuitry protection for  
portable devices  
Wireless Handsets  
Handheld PCs / PDAs  
MP3 Players  
Digital Cameras and Camcorders  
Notebooks  
The Chip Scale Package format of these devices  
enable extremely small footprints that are necessary in  
portable electronics such as cellular phones, PDAs,  
internet appliances and PCs. The large solder bumps  
allow for standard attachment to laminate boards with-  
out the use of underfill. The PACDN2404C,  
PACDN2408C and PACDN2416C are available with  
optional lead-free finishing.  
Desktop PCs  
Electrical Schematic  
B1 B2  
B3  
B1 B2  
B4 B5  
D1 D2 D3 D4 D5  
A1 A2  
A4 A5  
A1 A2  
A3  
A3  
C1 C2 C3 C4 C5  
PACDN2404C  
PACDN2408C  
B1 B2 B3  
B4 B5  
A1 A2 A3  
A4 A5  
PACDN2416C  
© 2003 California Micro Devices Corp. All rights reserved.  
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112  
L
Tel: 408.263.3214  
L
Fax: 408.263.7846  
L
www.calmicro.com  
1

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