生命周期: | Obsolete | 零件包装代码: | DFN |
包装说明: | HVSON, | 针数: | 10 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.84 | 模拟集成电路 - 其他类型: | SPDT |
JESD-30 代码: | S-XDSO-N10 | 长度: | 3 mm |
信道数量: | 1 | 功能数量: | 2 |
端子数量: | 10 | 标称断态隔离度: | 69 dB |
通态电阻匹配规范: | 0.05 Ω | 最大通态电阻 (Ron): | 0.6 Ω |
最高工作温度: | 80 °C | 最低工作温度: | -40 °C |
封装主体材料: | UNSPECIFIED | 封装代码: | HVSON |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
认证状态: | Not Qualified | 座面最大高度: | 0.85 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.8 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
最长断开时间: | 78 ns | 最长接通时间: | 90 ns |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | DUAL | 宽度: | 3 mm |
Base Number Matches: | 1 |
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